K9EUGY8S0M-BCK0 vs K9CHGY8S5C-CCK0 Vergleich

Detaillierter Direktvergleich von K9EUGY8S0M-BCK0 von Samsung Electro-Mechanics und K9CHGY8S5C-CCK0 von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Samsung Electro-Mechanics
K9EUGY8S0M-BCK0 K9EUGY8S0M-BCK0 - Samsung V-NAND Flash Memory | Samsung

K9EUGY8S0M-BCK0 - Samsung V-NAND Flash Memory | Samsung

K9EUGY8S0M-BCK0 ✓ Aktiv
Samsung Electronics
K9CHGY8S5C-CCK0 K9CHGY8S5C-CCK0 - Samsung NAND Flash Memory BGA-316 | Samsung

K9CHGY8S5C-CCK0 - Samsung NAND Flash Memory BGA-316 | Samsung

K9CHGY8S5C-CCK0 ✓ Aktiv

Spezifikationsvergleich

Parameter K9EUGY8S0M-BCK0 K9CHGY8S5C-CCK0
Marke Samsung Electro-Mechanics Samsung Electronics
Kategorie Memory ICs Memory ICs
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Manufacturer Samsung Electronics Samsung Electronics
Product Family K9-series V-NAND Flash —
Speichertyp NAND Flash (non-volatile) —
Density [DATA_NEEDED: memory density] [DATA_NEEDED: total density in Gb]
Speicherorganisation [DATA_NEEDED: organization x8/x16] x8 (8-bit data access), quad CE configuration
Cell Type [DATA_NEEDED: SLC/MLC/TLC/QLC] —
Versorgungsspannung [DATA_NEEDED: VCC voltage] —
VCCQ Voltage [DATA_NEEDED: VCCQ voltage] —
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] —
Access Time (tR) [DATA_NEEDED: read access time] —
Program Time (tPROG) [DATA_NEEDED: program time] —
Erase Time (tBERS) [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] —
Gehäuse [DATA_NEEDED: package type and dimensions] BGA-316
Betriebstemperatur [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Montageart Surface Mount Surface Mount (BGA reflow)
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Packing [DATA_NEEDED: tray or tape and reel] —
Product Type — NAND Flash Memory
Chip Enable Count — 16 (CE_n)
Pin Reduction — Not used
Supply Rail VCC — 1.83 V
Supply Rail (secondary) — 1.84 V
Supply Rail VCCQ-class — 2.96 V
Program/Erase Supply Rail — 12 V domain
Memory Technology — [DATA_NEEDED: cell type / V-NAND generation]
Schnittstellentyp — [DATA_NEEDED: toggle DDR / ONFI, max data rate]
Program/Erase Cycles — [DATA_NEEDED: P/E endurance]

Datenblätter & Ressourcen

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