Die Speicherpreise ändern sich täglich – die Preise auf der Website können hinter dem Markt zurückbleiben. Bitte senden Sie eine RFQ für das aktuellste Angebot.
Aktuellen Preis anfragen →
Samsung Electronics

K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics

Teilenummer: K9PRGY8S7M ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
BGA (surface mount) Package NAND Flash Memory
Kontakt für Preise
MOQ: 1 |
Preis aktualisiert: 2026-09-03
Mengenpreise
Menge Stückpreis Gesamt
1 $0 $0,00
10 $0 $0,00
100 $0 $0,00
500 $0 $0,00
1.000 $0 $0,00
ℹ️ Alle Preise sind in USD

K9PRGY8S7M Übersicht

The Samsung Electronics K9PRGY8S7M is a NAND flash memory integrated circuit belonging to Samsung's K9-series non-volatile memory lineup, supplied in a ball grid array (BGA) surface-mount package. Based on distributor listings (IC2IC, OMO Electronic, Alibaba), this device is cataloged as a Samsung NAND FLASH component and is actively traded on the open electronics market.

NAND flash is a type of non-volatile storage technology that retains data without power. Within the memory hierarchy, NAND flash sits below DRAM in speed but offers far higher density and lower cost per bit, making it the backbone of SSDs, eMMC modules, USB drives, memory cards, and embedded storage. NAND cells are arranged in series, which reduces die area and enables the multi-gigabit capacities required by modern consumer, industrial, and automotive systems. Samsung is one of the world's leading NAND producers, with its 3D V-NAND technology stacking cells vertically to increase density further.

Key characteristics of the K9-series include page-based program and block-based erase operations, asynchronous or toggled-mode interfaces, and internal ECC support on newer generations. Exact density, organization, page size, block size, and interface speed for this specific ordering code are not published in the retrieved web data and must be confirmed from the official Samsung datasheet.

Typical applications for this class of device include embedded storage in set-top boxes, smart TVs, industrial controllers, networking equipment, and solid-state drive assemblies where a raw NAND device is managed by a host controller or firmware layer such as FTL (Flash Translation Layer).

Design teams should confirm the exact package outline, ball map, supply voltage, and timing parameters against the Samsung datasheet before layout, since K9-series ordering codes encode density, configuration, and speed grade variations. Note that one distributor listing (OMO Electronic) attributes the MPN to BURNDY, which appears to be an indexing error given the K9 prefix and multiple corroborating NAND FLASH listings for Samsung.

This page synthesizes open-market sourcing data, lifecycle status, and alternative-part guidance not consolidated on any single distributor page.

Drop-in-Alternativen für K9PRGY8S7M – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit K9PRGY8S7M (gleiche Bauform und Footprint) – abweichend in Mounting Type, Memory Type, Package Type, RoHS Status, NAND Technology.

Samsung Electronics
Mounting Type: Surface Mount
Memory Type: NAND Flash
Vergleichen mit K9PRGY8S7M →
Samsung Electronics
Memory Type: NAND Flash (V-NAND, 3D)
RoHS Status: Compliant
Vergleichen mit K9PRGY8S7M →
Samsung Electronics
NAND Technology: Samsung V-NAND (3D TLC)
Vergleichen mit K9PRGY8S7M →
Samsung Electronics
Mounting Type: Surface Mount (BGA)
Package Type: 316-ball Fine Pitch BGA (FBGA-316)
NAND Technology: 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis)
Vergleichen mit K9PRGY8S7M →
Samsung Electronics
RoHS Status: Lead free / RoHS compliant
Vergleichen mit K9PRGY8S7M →
Samsung Electronics
RoHS Status: Lead free / RoHS compliant
Vergleichen mit K9PRGY8S7M →
Samsung Electronics
Mounting Type: Surface Mount
Memory Type: NAND Flash
Package Type: BGA (surface mount)
Vergleichen mit K9PRGY8S7M →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

K9PRGY8S7M-CCK0

✅ Drop-In
Samsung Electronics
📦 BGA
NAND Flash · Samsung Electronics · BGA (surface mount) · Surface Mount · Lead free / RoHS compliant

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

K9DMGY8J5B-CCK0

✅ Drop-In
📦 BGA
related Samsung flash part cross-listed in release-of-information notices; density suffix differs (DMG vs PRG) - verify organization

📋 Referenzalternative (nicht im Katalog)

K9PRGY8S7M Grenzwerte & elektrische Eigenschaften

Speichertyp NAND Flash
Manufacturer Samsung Electronics
Package Type BGA (surface mount)
Montageart Surface Mount

K9PRGY8S7M bga (surface mount) Pinbelegungsleitfaden

Pinbelegung für K9PRGY8S7M (bga (surface mount)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für K9PRGY8S7M im bga (surface mount)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für K9PRGY8S7M.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

K9PRGY8S7M ist geeignet für 6 Anwendungs: Solid-State Drive Storage, Embedded System Storage, Consumer Electronics Firmware Storage, Networking and Communication Equipment, Automotive Infotainment Data Storage, Industrial Data Loggers.

🖥️

Solid-State Drive Storage

The K9PRGY8S7M fits SSD data-storage arrays where a dedicated controller, such as Samsung's MEX (S4LN045X01) controller used in the Samsung 850 PRO SSD family, manages multiple NAND packages through a flash translation layer. In this role the NAND provides the non-volatile media while the controller handles ECC, wear leveling, and garbage collection. Performance depends on parallel channel configuration; connecting multiple K9-series packages across independent channels multiplies bandwidth and hides program/erase latencies. Designers should verify density, page size, and toggle-mode timing from the Samsung datasheet to configure controller timing registers correctly, and should budget spare blocks for wear-leveling overhead over the drive's rated endurance.

🏭

Embedded System Storage

In set-top boxes, smart TVs, industrial controllers, and networking equipment, the K9PRGY8S7M serves as bulk non-volatile storage for firmware images, application data, and logs. Raw K9-series NAND is appropriate when the host SoC includes a NAND flash controller with hardware ECC, allowing the BOM to avoid the cost premium of managed eMMC. The trade-off is firmware responsibility: the design team must implement bad-block management and wear leveling. Use the BGA footprint for space-constrained boards, and reserve spare blocks per the datasheet specification since block retirement accumulates over product lifetime in always-on devices with frequent logging writes.

📱

Consumer Electronics Firmware Storage

Consumer devices such as audio equipment, appliances, and toys require moderate-capacity non-volatile storage for code and user settings. The K9PRGY8S7M in a compact BGA surface-mount package supports automated assembly on high-volume lines. Because raw NAND density per package is high, one device often covers total firmware plus data needs, simplifying the BOM. Designers should implement a boot-block protection scheme so the primary firmware region is not erased by errant writes, and should validate cold-temperature boot timing since NAND read latency tolerances must remain within controller timing windows across the rated operating range.

🌐

Networking and Communication Equipment

Routers, switches, and baseband cards use K9-series NAND to store OS images, configuration files, and traffic logs. The K9PRGY8S7M provides the raw media while the system's CPU companion controller executes the FTL. High write-frequency logging workloads make wear leveling quality a reliability differentiator; industrial networking equipment should derate endurance generously and monitor block wear via SMART-style telemetry. When dual-bank firmware update schemes are used, capacity planning must account for storing two complete images simultaneously. Confirm supply voltage and interface timing from the Samsung datasheet to match the SoC's memory controller configuration before tape-out.

🚗

Automotive Infotainment Data Storage

Automotive infotainment head units and telematics boxes store navigation maps, media, and diagnostic logs on NAND flash. While the K9PRGY8S7M itself is not AEC-Q100 qualified per the available data, K9-series devices are used in consumer-grade automotive tiers where a dedicated controller with strong ECC handles the harsh electrical environment. For safety-relevant designs, prefer Samsung automotive-qualified storage such as the K4R-series automotive DRAM family for working memory paired with an eMMC. Wide supply-voltage transients, extended temperature derating, and power-fail integrity (write-atomic FTL journaling) are the key engineering considerations in this deployment.

🔧

Industrial Data Loggers

Industrial data loggers and SCADA edge nodes write sensor records continuously for years, making NAND endurance and power-fail robustness the dominant design factors. The K9PRGY8S7M provides dense raw storage; the controller must journal writes so a brownout never corrupts committed records, and must balance wear across blocks to reach the system lifetime target. Estimated: if the application writes 100 MB per day and the device endurance supports the datasheet P/E cycle count, capacity planning should include 2x over-provisioning for wear leveling. Verify the exact P/E cycle rating and page program time from the official Samsung datasheet before finalizing the endurance budget.

What is the K9PRGY8S7M?
The K9PRGY8S7M is a Samsung Electronics NAND flash memory integrated circuit from the K9-series of non-volatile storage devices. According to open-market distributor listings such as IC2IC and OMO Electronic, it is cataloged as a Samsung NAND FLASH component supplied in a BGA surface-mount package. The exact density and configuration encoded in the ordering code should be confirmed from the official Samsung datasheet before design-in.
Where can I buy K9PRGY8S7M online?
The K9PRGY8S7M is available through open-market and independent distributors rather than authorized catalog distributors. Sources found in web data include OMO Electronic (omo-ic.com), IC2IC broker listings, and Alibaba suppliers such as the K9PRGY8S7M-CCK0 listing. Since this is a quote-based commodity memory part, XAIPART provides RFQ-based sourcing; contact us with your quantity for a current quotation as of 2026-09-04.
What is the price of K9PRGY8S7M?
There is no fixed published unit price for the K9PRGY8S7M. Alibaba supplier pages explicitly warn that cyclical NAND flash market fluctuations make listed prices reference-only and that the final transaction price comes from a quote. For current volume pricing as of 2026-09-04, submit an RFQ with quantity and required speed grade; NAND commodity pricing can move significantly within weeks.
What is the lead time for K9PRGY8S7M?
Lead time for the K9PRGY8S7M is quote-dependent because it is sourced through independent and open-market channels rather than franchise distribution stock. Broker listings on IC2IC and Alibaba typically ship within days to a few weeks depending on quantity and region. For firm availability and delivery schedules as of 2026-09-04, request a quote specifying quantity, date code requirements, and packaging.
Is K9PRGY8S7M the same as K9PRGY8S7M-CCK0?
No, they are closely related ordering codes, not identical parts. The base code K9PRGY8S7M identifies the die and package family, while the -CCK0 suffix encodes the speed grade and package-processing variant in Samsung's naming convention. Functionally they are the same die family and are frequently listed interchangeably by brokers, but always verify the suffix meaning in the Samsung datasheet because speed grade affects controller timing configuration.
Where can I download the K9PRGY8S7M datasheet PDF?
The K9PRGY8S7M datasheet is not hosted as a direct public PDF in the retrieved web data. Samsung datasheets for K9-series NAND are typically distributed under the component ordering code through alldatasheet.com or on request from Samsung. Alibaba listings state that suppliers will provide the datasheet and high-resolution images on request. On XAIPART, use the datasheet request form and we will supply the official document.
What is the best drop-in replacement for K9PRGY8S7M?
The closest drop-in candidate found in web data is the K9DMGY8J5B-CCK0, another Samsung flash device frequently cross-listed alongside the K9PRGY8S7M in release-of-information notices. However, because exact density, ball map, and organization for both ordering codes are not published in the retrieved data, pin-to-pin compatibility must be verified against the Samsung datasheets before any substitution. Do not redesign around a substitute without confirming the ball map and FTL compatibility.
What are the key specifications of K9PRGY8S7M that engineers should know?
Engineers should know that the K9PRGY8S7M is a Samsung K9-series NAND flash IC in a BGA surface-mount package. Confirmed attributes: manufacturer Samsung Electronics, memory technology NAND flash, active lifecycle status per OMO Electronic. Unconfirmed and requiring the Samsung datasheet: density, page/block organization, supply voltage, interface speed, P/E cycle endurance, and ball count. This distinction between verified and datasheet-dependent parameters is critical for safe design-in.
Is K9PRGY8S7M suitable for SSD applications?
Yes, K9-series Samsung NAND of this class is used in SSD and embedded storage assemblies, as evidenced by the web-data connection between Samsung K9 NAND and SSD products such as the Samsung 850 PRO family, which uses Samsung NAND managed by the MEX controller with DRAM cache. Raw NAND like the K9PRGY8S7M requires a host controller with a flash translation layer (FTL), ECC, and wear-leveling firmware; it is not a plug-and-play storage device by itself.
When should I choose raw K9-series NAND over an eMMC module?
Choose raw NAND such as the K9PRGY8S7M when your system has its own storage controller and you need lowest cost per bit and full control of the flash management layer, as in SSD controllers or custom storage appliances. Choose an eMMC module (such as Samsung's K3L-series found on XAIPART) when you want integrated controller, ECC, and standard JEDEC eMMC interface with faster time to market. Raw NAND saves BOM cost but transfers firmware complexity to your team.
What is the best Micron equivalent for K9PRGY8S7M?
No Micron cross-brand equivalent for the K9PRGY8S7M was found in the retrieved cross-reference data, so none can be recommended with confidence. A Micron equivalent would need to match the Samsung part's density, page/block organization, asynchronous or toggle-mode interface timing, and BGA ball map exactly to be drop-in. Search Micron's NAND portfolio parametrically and verify with both manufacturers' datasheets; do not rely on partial MPN similarity for qualification.
Is K9PRGY8S7M still in production?
Yes, the K9PRGY8S7M shows an active lifecycle. The OMO Electronic listing states Lifecycle: New from this manufacturer, and it continues to appear in current broker stock lists, with an IC2IC listing dated January 2026. Samsung has not issued an end-of-life notice in the retrieved data. For long-production-run designs, still request a formal PCN/EOL commitment from Samsung or your distributor since commodity NAND lines are frequently superseded.
Does the K9PRGY8S7M require ECC and wear leveling?
Yes, like all raw NAND flash, the K9PRGY8S7M requires external or host-side management. NAND cells degrade with program/erase cycles and are subject to bit errors, so the host controller must implement error-correcting code (ECC) and wear leveling, typically via a flash translation layer (FTL). Newer Samsung K9 generations may include some internal ECC assistance, but the system-level FTL remains the designer's responsibility. This is the main engineering difference versus managed eMMC storage.
How is the K9PRGY8S7M packaged and shipped?
The K9PRGY8S7M is a BGA surface-mount device supplied in standard memory-IC packaging, typically tape and reel or tray format depending on supplier. Specific standard quantity per reel or tray is not published in the retrieved data and should be confirmed at quotation. Broker channels also offer cut-tape or tray quantities. Specify moisture-barrier bag and MSL handling requirements when ordering, since BGA NAND requires proper dry-pack storage before reflow.

Technische Referenzdaten für K9PRGY8S7M – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the K9PRGY8S7M when your system already includes a NAND controller with hardware ECC and you need the lowest cost per bit of raw non-volatile storage in a compact BGA package - typical for SSD assemblies, custom storage appliances, and SoC designs with integrated NAND interfaces. Choose a managed Samsung eMMC module such as the K3L-series when your team lacks flash-management firmware resources or time-to-market matters more than BOM cost, since eMMC integrates the controller, ECC, and standard JEDEC interface. If the exact K9PRGY8S7M ordering code is unavailable, the K9PRGY8S7M-CCK0 and K9DMGY8J5B-CCK0 are the nearest Samsung family members, but both require datasheet verification of density, ball map, and speed grade before qualification. For new designs, also evaluate current-generation Samsung V-NAND parts for better endurance. Always confirm exact parameters from official Samsung documentation before design freeze.

Vergleich mit Alternativen

Parameter Dieses Produkt K9PRGY8S7M-CCK0 K9DMGY8J5B-CCK0
Brand Samsung Electronics Samsung Electronics Samsung Electronics
Package BGA (surface mount) BGA - same footprint family BGA - verify ball map
Memory Type NAND Flash NAND Flash NAND Flash
Speed Grade Suffix Base ordering code -CCK0 -CCK0
Lifecycle Status Active Active (broker listings) Active (broker listings)

Wichtigste Unterscheidungsmerkmale

  • Samsung-origin K9-series NAND die (vs. K9DMGY8J5B-CCK0)
  • Raw NAND cost efficiency (vs. K3LKJKJ0CM-MUCP (eMMC))
  • BGA surface-mount format (vs. TSOP-packaged legacy K9 NAND)

Designhinweise

One open-market listing (OMO Electronic) attributes K9PRGY8S7M to BURNDY, but this contradicts the K9 Samsung naming convention and multiple corroborating NAND FLASH listings from IC2IC and Alibaba naming Samsung. When sourcing from brokers, insist on Samsung-original marking, date codes, and, where possible, supplierqualification samples. Counterfeit or remarked NAND is a well-known risk in open-market memory procurement, and a misidentified density can cause hard failures at FTL initialization.

BGA-packaged NAND requires careful escape routing: plan ball-out fan-out before finalizing the footprint, use via-in-pad or dog-bone escapes consistent with your fab's capability, and verify the exact ball map from the official Samsung datasheet rather than assuming a generic BGA pattern. Keep the solder mask-defined pad geometry per JEDEC-style BGA land patterns specified by Samsung, and control reflow profile to avoid solder bridging on fine-pitch ball rows. Confirm ball count and package dimensions from the datasheet before library creation.

Decouple the NAND supply rails with at least 100 nF ceramic capacitor per supply ball pair plus one bulk capacitor per device, placed close to the BGA. Because this raw NAND shares a supply domain with the host controller in most designs, ensure power-fail detection circuitry can gate write enable in time to prevent torn page writes; a supervisory circuit with early-warning threshold gives the FTL time to complete or abort the current program operation cleanly.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Compliance status not stated in retrieved web data. Samsung memory products are typically RoHS compliant, but this must be confirmed from the official product page or datasheet.

Daten verifiziert am: 2026-09-04 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

K9PRGY8S7M K9PRGY8S7M datasheet Samsung K9PRGY8S7M NAND flash K9PRGY8S7M-CCK0 specifications K9PRGY8S7M BGA NAND memory K9PRGY8S7M SSD NAND storage K9PRGY8S7M vs K9DMGY8J5B-CCK0 K9PRGY8S7M drop-in replacement K9PRGY8S7M price buy stock what is K9PRGY8S7M NAND flash K9PRGY8S7M equivalent substitute Samsung K9 series NAND flash embedded storage

Verwandte Bauteile & Begriffe

Samsung Electronics K9PRGY8S7M K9PRGY8S7M-CCK0 K9DMGY8J5B-CCK0 NAND flash NAND FLASH memory non-volatile memory flash memory K9-series V-NAND BGA package surface mount memory IC SSD storage flash translation layer ECC wear leveling eMMC MEX controller (S4LN045X01) FTL Samsung 850 PRO SSD IC2IC OMO Electronic alldatasheet.com
Schnellangebot-RFQ
Geben Sie alle Details an – unser Vertriebsteam antwortet innerhalb von 24 Stunden
Teilenummer Hersteller Gehäuse QTY Zielpreis Gesamt
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

1
RFQ gesendet
2
Angebot erhalten
3
Bestellung aufgegeben
4
Zahlung
5
Versandt
6
Geliefert
RFQ-Details ansehen