K9QDGB8U7M vs K9MDG08U5M Vergleich
Detaillierter Direktvergleich von K9QDGB8U7M von Samsung Electronics und K9MDG08U5M von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | K9QDGB8U7M | K9MDG08U5M |
|---|---|---|
| Marke | Samsung Electronics | Samsung Electronics |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Unknown | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $35,50 |
| Manufacturer | Samsung Electronics | — |
| Product Family | K9 NAND Flash | — |
| Speichertyp | NAND Flash | MLC Large Block NAND Flash |
| Density | [DATA_NEEDED: Density] | 16 Gbit (2 GB) |
| Speicherorganisation | [DATA_NEEDED: Organization] | 16G x 8 bit |
| Schnittstellentyp | [DATA_NEEDED: Interface Type] | — |
| Versorgungsspannung | [DATA_NEEDED: Supply Voltage] | — |
| Page Size | [DATA_NEEDED: Page Size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: Block Size] | [DATA_NEEDED: block size] |
| Program/Erase Endurance | [DATA_NEEDED: Program/Erase Endurance] | — |
| Read Latency | [DATA_NEEDED: Read Latency] | — |
| Package Type | BGA (surface mount) | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | unknown |
| Cell Type | — | MLC (2 bits per cell) |
| Supply Voltage Min | — | 2.7 V |
| Supply Voltage Max | — | 3.6 V |
| Schnittstelle | — | Asynchronous x8 multiplexed address/data |
| Gehäuse | — | 48-pin TSOP1 dual stacked, 12 mm x 20 mm |
| Terminals | — | 48 |
| Circuits | — | 1 |
| Die Configuration | — | Dual stacked |
| Page Read Time (tR) | — | [DATA_NEEDED: tR] |
| Program Time (tPROG) | — | [DATA_NEEDED: tPROG] |