K9QDGB8U7M vs K9MDG08U5M Comparaison
Comparaison détaillée côte à côte de K9QDGB8U7M par Samsung Electronics et K9MDG08U5M par Samsung Electronics. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | K9QDGB8U7M | K9MDG08U5M |
|---|---|---|
| Marque | Samsung Electronics | Samsung Electronics |
| Catégorie | Memory ICs | Memory ICs |
| Statut du cycle de vie | Unknown | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $35,50 |
| Manufacturer | Samsung Electronics | — |
| Product Family | K9 NAND Flash | — |
| Type de mémoire | NAND Flash | MLC Large Block NAND Flash |
| Density | [DATA_NEEDED: Density] | 16 Gbit (2 GB) |
| Organisation de la mémoire | [DATA_NEEDED: Organization] | 16G x 8 bit |
| Type d'interface | [DATA_NEEDED: Interface Type] | — |
| Tension d'alimentation | [DATA_NEEDED: Supply Voltage] | — |
| Page Size | [DATA_NEEDED: Page Size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: Block Size] | [DATA_NEEDED: block size] |
| Program/Erase Endurance | [DATA_NEEDED: Program/Erase Endurance] | — |
| Read Latency | [DATA_NEEDED: Read Latency] | — |
| Package Type | BGA (surface mount) | — |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS Status] | unknown |
| Cell Type | — | MLC (2 bits per cell) |
| Supply Voltage Min | — | 2.7 V |
| Supply Voltage Max | — | 3.6 V |
| Interface | — | Asynchronous x8 multiplexed address/data |
| Boîtier | — | 48-pin TSOP1 dual stacked, 12 mm x 20 mm |
| Terminals | — | 48 |
| Circuits | — | 1 |
| Die Configuration | — | Dual stacked |
| Page Read Time (tR) | — | [DATA_NEEDED: tR] |
| Program Time (tPROG) | — | [DATA_NEEDED: tPROG] |