LPC55S28JBD64K vs LPC55S28JBD64Y Vergleich
Detaillierter Direktvergleich von LPC55S28JBD64K von NXP Semiconductors und LPC55S28JBD64Y von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | LPC55S28JBD64K | LPC55S28JBD64Y |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,60 | $3,80 |
| Core Processor | ARM Cortex-M33 (Armv8-M mainline) | ARM Cortex-M33 |
| Core Size | 32-bit | 32-bit |
| Maximale Taktfrequenz | 150 MHz | 150 MHz |
| Flash Memory | 512 KB | 512 KB (512K x 8) |
| SRAM | 104 KB | — |
| Versorgungsspannung | 3.3 V (1.8 V to 3.6 V range) | — |
| Security Features | TrustZone, secure boot (S variant) | — |
| Peripherals | Flexcomm serial interfaces, USB full-speed device, dual 12-bit ADC, timers/PWM, DMA | — |
| Connectivity | UART, SPI, I2C, I2S via Flexcomm | Flexcomm, I2C, SDIO, SPI, UART/USART, USB |
| Number of I/O | [DATA_NEEDED: Number of GPIO pins] | — |
| Betriebstemperatur | [DATA_NEEDED: Operating temperature range] | — |
| Gehäuse | 64-HTQFP (10x10 mm) with exposed pad | 64-HTQFP (10x10 mm), Square |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 40-nm NVM | 40 nm NVM |
| Product Family | LPC55S2x (LPC5500 Series, EdgeVerse platform) | LPC55S2x (EdgeVerse platform) |
| Program Memory Type | FLASH | — |
| Data Converters | Dual 12-bit ADC | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Core Revision | — | r0p3 |
| Memory Protection Unit (MPU) | — | Yes |
| Interrupt Controller | — | NVIC (built-in) |
| NMI Input | — | Yes, with selectable sources |
| Terminal Form | — | Gull Wing |
| Number of Terminals | — | 64 |
| Temperature Grade | — | Industrial |
| Packaging Suffix | — | Y = Tape & Reel |