LPC55S28JBD64K vs LPC55S28JBD64Y 对比

详细并排对比 LPC55S28JBD64K 出自 NXP Semiconductors 和 LPC55S28JBD64Y 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
LPC55S28JBD64K LPC55S28JBD64K - 150MHz Cortex-M33 MCU 512KB | NXP

LPC55S28JBD64K - 150MHz Cortex-M33 MCU 512KB | NXP

LPC55S28JBD64K ✓ 量产中
NXP Semiconductors
LPC55S28JBD64Y LPC55S28JBD64Y - 150MHz Cortex-M33, 512KB Flash MCU | NXP

LPC55S28JBD64Y - 150MHz Cortex-M33, 512KB Flash MCU | NXP

LPC55S28JBD64Y ✓ 量产中

规格对比

参数 LPC55S28JBD64K LPC55S28JBD64Y
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $3.60 $3.80
Core Processor ARM Cortex-M33 (Armv8-M mainline) ARM Cortex-M33
Core Size 32-bit 32-bit
最大时钟频率 150 MHz 150 MHz
Flash Memory 512 KB 512 KB (512K x 8)
SRAM 104 KB —
电源电压 3.3 V (1.8 V to 3.6 V range) —
Security Features TrustZone, secure boot (S variant) —
Peripherals Flexcomm serial interfaces, USB full-speed device, dual 12-bit ADC, timers/PWM, DMA —
Connectivity UART, SPI, I2C, I2S via Flexcomm Flexcomm, I2C, SDIO, SPI, UART/USART, USB
Number of I/O [DATA_NEEDED: Number of GPIO pins] —
工作温度 [DATA_NEEDED: Operating temperature range] —
封装 64-HTQFP (10x10 mm) with exposed pad 64-HTQFP (10x10 mm), Square
安装类型 Surface Mount Surface Mount
Process Technology 40-nm NVM 40 nm NVM
Product Family LPC55S2x (LPC5500 Series, EdgeVerse platform) LPC55S2x (EdgeVerse platform)
Program Memory Type FLASH —
Data Converters Dual 12-bit ADC —
RoHS 状态 [DATA_NEEDED: RoHS status] —
Core Revision — r0p3
Memory Protection Unit (MPU) — Yes
Interrupt Controller — NVIC (built-in)
NMI Input — Yes, with selectable sources
Terminal Form — Gull Wing
Number of Terminals — 64
Temperature Grade — Industrial
Packaging Suffix — Y = Tape & Reel

数据手册与资源

浏览全部产品 创建 BOM 获取报价