LPC55S28JBD64Y vs LPC55S26JBD64Y Vergleich
Detaillierter Direktvergleich von LPC55S28JBD64Y von NXP Semiconductors und LPC55S26JBD64Y von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | LPC55S28JBD64Y | LPC55S26JBD64Y |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,80 | $0,00 |
| Core Processor | ARM Cortex-M33 | ARM Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| Core Revision | r0p3 | — |
| Maximale Taktfrequenz | 150 MHz | 150 MHz |
| Flash Memory | 512 KB (512K x 8) | — |
| Connectivity | Flexcomm, I2C, SDIO, SPI, UART/USART, USB | — |
| Memory Protection Unit (MPU) | Yes | — |
| Interrupt Controller | NVIC (built-in) | — |
| NMI Input | Yes, with selectable sources | — |
| Gehäuse | 64-HTQFP (10x10 mm), Square | 64-HTQFP (10 x 10 mm), exposed pad |
| Terminal Form | Gull Wing | — |
| Number of Terminals | 64 | 64 |
| Montageart | Surface Mount | Surface Mount (Gull Wing terminals) |
| Temperature Grade | Industrial | Industrial |
| Process Technology | 40 nm NVM | 40-nm NVM |
| Product Family | LPC55S2x (EdgeVerse platform) | — |
| Packaging Suffix | Y = Tape & Reel | — |
| Program Flash Memory | — | 256 KB (256K x 8) |
| Versorgungsspannung | — | 3.3 V |
| Product Series | — | LPC552x / LPC55S2x |
| Package Shape | — | Square |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Peripheral Compatibility | — | Pin-, software- and peripheral-compatible with LPC552x/S2x family |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |