M1AFS1500-1FG256K vs M1AFS1500-2FGG256 Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FG256K von Microchip Technology und M1AFS1500-2FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip
M1AFS1500-1FG256K ✓ AktivMicrochip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FG256K | M1AFS1500-2FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $627,13 | $124,50 |
| Manufacturer | Microchip Technology | — |
| Family | Fusion (Mixed-Signal Flash FPGA) | — |
| System Gates | 1500000 | 1,500,000 |
| Logic Cells | 38400 | 38,400 |
| Number of I/O | 119 | 119 |
| Flash Memory | 276480 bits | — |
| Processor Core | ARM Cortex-M1 (soft core) | — |
| Speed Grade | -1 | -2 |
| Gehäuse | 256-LBGA (FG256) | — |
| Montageart | Surface Mount | — |
| Configuration Technology | Flash (instant-on, single-chip) | — |
| Analog Features | Configurable analog blocks (Fusion mixed-signal) | — |
| Programmability | In-System Programmable | — |
| RoHS-Status | RoHS Non-Compliant | — |
| Lead Free Status | Contains Lead | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| Embedded Memory Blocks | [DATA_NEEDED: SRAM block size] | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | M1AFS1500 (Fusion) |
| Embedded Processor | — | ARM Cortex-M1 |
| Maximale Taktfrequenz | — | 350 MHz |
| Betriebsversorgungsspannung | — | 1.5 V |
| Flash Memory Bits (reported) | — | 276480 |
| Technology | — | CMOS, 130nm class |
| Gehäuse / Bauform | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Montagestil | — | SMD/SMT |
| Betriebstemperaturbereich | — | 0C to +70C |
| Analog Blocks | — | Configurable analog (Fusion mixed-signal architecture) |
| Programming Type | — | Flash-based (in-system programmable) |
| Packaging | — | Tray |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Total RAM Blocks | — | [DATA_NEEDED: RAM block count] |