M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip
Teilenummer: M1AFS1500-2FGG484I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $251.39 | $251,39 |
| 10 | $238.82 | $2.388,20 |
| 100 | $226.25 | $22.625,00 |
| 500 | $213.68 | $106.840,00 |
| 1.000 | $201.11 | $201.110,00 |
M1AFS1500-2FGG484I Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that designers configure in the field, sitting at the top of the programmable logic hierarchy that spans SPLDs, CPLDs, and FPGAs. The Fusion family extends this concept to mixed-signal system-on-chip integration by monolithically combining flash-based programmable fabric with configurable analog blocks, clock management, and a hard ARM processor core.
Key features of the M1AFS1500 variant include the ARM Cortex-M1 soft-capable processor support, flash-based LivePro reprogrammability, comprehensive clock generation and management circuitry (CCM), and large flash memory blocks integrated on-die. Speed grade 2 denotes a fabric that is 25% faster than the standard speed grade, supporting higher system clock frequencies in timing-critical designs.
The device is fabricated in a 130nm flash-based CMOS process operating from a 1.5V core supply. Unlike SRAM FPGAs from Xilinx or Altera (Intel), the Fusion fabric is inherently non-volatile and secure: configuration data resides in on-chip flash, eliminating the need for an external boot flash and reducing configuration-time glitch and cloning risks. Deterministic 1.5V core operation simplifies power-tree design compared with multi-rail SRAM FPGAs.
Typical applications include industrial automation and motor control (leveraging the mixed-signal analog peripherals), aerospace and defense systems requiring secure non-volatile configuration, test and measurement instrumentation, and embedded control systems where a hard ARM core plus programmable logic in one package replaces a two-chip MCU-plus-FPGA solution.
Design consideration: budget power carefully - the 484-ball package supports substantial logic utilization, so perform thermal estimation with Microchip Libero SoC power tools and provide adequate PCB copper area under the BGA for heat spreading.
This page synthesizes distributor pricing, drop-in same-package alternatives, FAQs, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für M1AFS1500-2FGG484I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS1500-2FGG484I (gleiche Bauform und Footprint) – abweichend in Package, Family, Configuration Memory, Process Technology, System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS1500-1FGG484K
✅ Drop-In✓ Auf Lager
$1560 / Stück
Datenblatt ansehen →M1AFS1500-2FGG484
✅ Drop-In✓ Auf Lager
$201.11 / Stück
Datenblatt ansehen →M1AFS1500-2FGG484YI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-FG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AFS1500-2FGG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-2FGG484I Grenzwerte & elektrische Eigenschaften
| Family | Fusion (M1 series) |
| System Gates | 1500000 gates |
| Logic Cells | 38400 |
| Embedded Processor | ARM Cortex-M1 |
| User I/O | 223 |
| Flash Configuration Memory | 276480 bits |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash-based CMOS |
| Speed Grade | 2 (25% faster than standard) |
| Gehäuse | 484-ball FBGA (FGG484), 1.00 mm ball pitch |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial, junction) |
| Programmability | In-system reprogrammable flash (LivePro) |
| Volatility | Non-volatile (on-chip flash configuration) |
| Analog Peripherals | Mixed-signal configurable analog blocks |
| Clock Management | Comprehensive clock generation and management (CCM) |
M1AFS1500-2FGG484I 484-ball fbga (fgg484), 1.00 mm ball pitch Pinbelegungsleitfaden
Pinbelegung für M1AFS1500-2FGG484I (484-ball fbga (fgg484), 1.00 mm ball pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS1500-2FGG484I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS1500-2FGG484I ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Aerospace and Defense Embedded Control, Test and Measurement Instrumentation, Secure Embedded Systems and IoT Gateways, Communications and Networking Line Cards, Medical Device Control Electronics.
Industrial Automation and Motor Control
The M1AFS1500-2FGG484I fits motor-control and factory-automation nodes because its Fusion mixed-signal architecture integrates configurable analog blocks - voltage, current, and temperature monitoring - directly beside deterministic flash-based logic and the ARM Cortex-M1 processor. Multi-axis PWM generation, encoder decoding, and fieldbus interfaces (CAN, SPI, UART) fit within the 38400 logic cells and 223 user I/Os. Placing the analog supervision on-die removes external ADCs and reduces BOM count, while the industrial -40C to +100C junction rating survives harsh cabinet environments. Speed grade 2 fabric sustains the high PWM carrier frequencies needed for low-torque-ripple servo loops, and single-chip flash configuration means no external boot device to fail in electrically noisy drives.
Empfohlen
Aerospace and Defense Embedded Control
Defense and space-adjacent programs favor the M1AFS1500-2FGG484I because its flash-based fabric is inherently non-volatile and resistant to configuration upset compared with SRAM FPGAs that reload from external memory. The on-chip flash configuration eliminates boot-device attack surface and supports Microchip's security features. The ARM Cortex-M1 hosts command-and-control firmware while programmable logic handles sensor interfaces, and the 1.5V single-core rail simplifies power-supply qualification on radiation- and EMI-constrained platforms. The industrial -40C to +100C rating covers wide-temperature avionics bays, and the 484-ball 1.00 mm-pitch BGA provides reliable second-level interconnect for high-vibration environments. Availability from Microsemi/Microchip legacy channels supports long program lifecycles.
Empfohlen
Test and Measurement Instrumentation
Bench and modular instruments use the M1AFS1500-2FGG484I as a mixed-signal acquisition and sequencing engine: the FPGA fabric timestamps events and drives stimulus, while integrated analog channels monitor supply rails and self-temperature. The ARM Cortex-M1 runs the instrument's command parser (SCPI-style protocols) without a separate microcontroller, and 223 I/Os interface front-end ADCs, relays, and display subsystems. Speed grade 2 timing supports high-rate state machines and DDR-style capture paths. Because configuration is flash-resident, instruments power up functional in under a second - important for rack systems with sequenced boot. The 1.5V core with modest static power keeps thermal design straightforward inside sealed instrument enclosures.
Empfohlen
Secure Embedded Systems and IoT Gateways
The M1AFS1500-2FGG484I addresses secure edge gateways where IP protection and tamper resistance matter. Flash-based configuration is inherently more secure than SRAM bitstream loading, reducing cloning and glitching risk per Microchip Fusion security design intent. The ARM Cortex-M1 executes protocol stacks while fabric implements custom accelerators; integrated analog blocks enable supply-glitch and temperature tamper detection without extra silicon. The 1.5V single-rail core plus flash fabric yields low static power suited to always-on nodes, and the 223 I/Os connect multiple PHYs, sensors, and secure elements. Industrial temperature rating and long-term availability from a single vendor simplify qualification for deployed fleets requiring 10-year service commitments.
Empfohlen
Communications and Networking Line Cards
Legacy networking line cards and control planes use the M1AFS1500-2FGG484I for board management and low-rate datapath glue: I2C/SMD management buses, fan and supply supervision via the analog blocks, and flash-resident boot logic that brings the card up before the main switch fabric loads. The Cortex-M1 replaces an external BMC microcontroller, and 223 I/Os interface LEDs, hot-swap controllers, and backplane connectors. Speed grade 2 fabric handles frame counters and CRC engines at line-card management rates. Deterministic power-up from on-chip flash suits systems with strict reset-sequencing requirements across redundant shelves, and the industrial grade covers telecom central-office temperature envelopes.
Empfohlen
Medical Device Control Electronics
Patient-connected and laboratory medical devices benefit from the M1AFS1500-2FGG484I's single-chip integration: the Cortex-M1 runs the device state machine and user interface while deterministic flash fabric handles safety interlocks and sensor front-end timing. Integrated analog channels perform continuous supply and self-diagnostics supporting IEC 60601-style self-test architectures (verify applicability per your regulatory assessment), reducing external monitoring components. The non-volatile configuration eliminates boot-time windows where the device is unprotected, and the industrial temperature range accommodates autoclave-adjacent and cold-chain storage environments. Low static power from the flash fabric helps battery-powered portable diagnostic instruments meet runtime targets without active cooling.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS1500-2FGG484I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS1500-1FGG484K | M1AFS1500-2FGG484 | M1AFS1500-2FGG484YI | AFS1500-2FGG484I |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484) | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball PBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (Microsemi) |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/O | 223 | 223 | 223 | 223 | 223 |
| Speed Grade | 2 (25% faster) | 1 (15% faster) | 2 (25% faster) | 2 (25% faster) | 2 (25% faster) |
| Temperature Range | -40C to +100C (industrial) | Industrial (K suffix) | Commercial (0C to +70C) | Industrial (I suffix) | -40C to +100C (industrial) |
| ARM Cortex-M1 Processor | Yes (M1 prefix) | Yes (M1 prefix) | Yes (M1 prefix) | Yes (M1 prefix) | No M1 designation (baseline AFS) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Flash Configuration Memory | 276480 bits (on-chip) | 276480 bits | 276480 bits | 276480 bits | 276480 bits |
Wichtigste Unterscheidungsmerkmale
- ARM Cortex-M1 processor integrated (M1 prefix) (vs. AFS1500-2FGG484I)
- Industrial temperature rating (vs. M1AFS1500-2FGG484)
- Highest readily available speed grade in FGG484 (vs. M1AFS1500-1FGG484K)
Designhinweise
The M1AFS1500-2FGG484I operates from a 1.5V core supply in a 130nm flash process; flash-based Fusion fabric draws essentially zero static configuration power, but dynamic power scales with clock frequency and logic utilization. Estimate total power with Microchip Libero SoC power-analysis tools using your post-place-and-route netlist before finalizing the VRM. Provide independent, well-decoupled rails for core, I/O banks, and analog blocks per the Fusion datasheet power-supply architecture, and sequence I/O rails relative to core per the datasheet power-up requirements.
The FGG484 package uses a 1.00 mm ball pitch requiring a solder-mask-defined pad layout with approximately 0.5 mm pads; follow the Microchip FGG484 land-pattern file exactly. Escape routing on 8-layer or more PCB stackups is practical with 0.2 mm via-in-pad or dog-bone escapes. Place 100 nF ceramic decoupling capacitors at the four package corners and near each supply-ball cluster. Expose adequate copper under the BGA for heat spreading, and inspect assemblies with X-ray or AOI given the hidden-ball geometry.
Do not confuse commercial-temperature M1AFS1500-2FGG484 with this industrial -I part in designs rated below 0C or above +70C ambient. Confirm speed grade in your Libero timing report: designs closed on speed grade 2 may fail on the cheaper -1 grade. When substituting AFS1500 (non-M1) parts, verify that your design does not depend on the ARM Cortex-M1 designation. Finally, secure your bitstream using the Fusion flash security features - never leave default configuration protection disabled in deployed hardware.
Compliance-Informationen
Compliance data not present in provided web data. Verify RoHS/REACH status on the official Microchip product page or Microchip's environmental compliance documentation.
