M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip
Teilenummer: M1AFS1500-1FGG676 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
M1AFS1500-1FGG676 Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program after manufacturing. Within the programmable logic hierarchy, the Fusion family sits in the FPGA -> programmable logic -> logic IC taxonomy, and the M1AFS1500 stands out because it is a mixed-signal FPGA: it monolithically integrates flash-based programmable fabric with configurable analog blocks, flash memory, and clock management circuitry.
Key differentiating specifications include 1.5 million system gates on a 130 nm flash-based process, 38,400 logic cells, 252 I/O for wide bus interfaces, and 1.5 V operation. Unlike SRAM FPGAs, the flash-based configuration is inherently non-volatile and live-at-power-up, removing the need for an external boot PROM and improving design security.
The Fusion architecture combines programmable logic with analog peripherals such as voltage/temperature monitoring channels and on-chip clock generation and management circuitry, enabling system-on-chip style consolidation of board-level glue logic, power monitoring, and sequencing functions.
Typical applications include industrial automation and motor drive control, power supply and system health monitoring, aerospace and defense embedded control, and portable instrumentation where integration of analog monitoring with programmable logic reduces board space and BOM cost.
Design consideration: the '-1' speed grade and 0C to +70C commercial temperature range mean this exact ordering code should be selected only for standard commercial environments; the industrial 'I' variant (M1AFS1500-1FGG676I) is required for -40C to +100C operation.
This page synthesizes distributor pricing data, drop-in alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet, providing unique cross-reference value for shortage and redesign decisions.
Drop-in-Alternativen für M1AFS1500-1FGG676 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS1500-1FGG676 (gleiche Bauform und Footprint) – abweichend in Package, Package / Case, Technology, Core Supply Voltage, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS1500-1FGG676I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M1AFS1500-FGG676
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →M1AFS1500-1FGG676Y
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-1FGG676YI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-FGG676I
✅ Drop-In✓ Auf Lager
$89.9 / Stück
Datenblatt ansehen →M1AFS1500-FG676
✅ Drop-In✓ Auf Lager
$372 / Stück
Datenblatt ansehen →M1AFS1500-1FGG676 Grenzwerte & elektrische Eigenschaften
| Manufacturer Part Number | M1AFS1500-1FGG676 |
| Series | M1AFS1500 (Fusion) |
| Number of Equivalent Gates | 1,500,000 gates |
| Number of Logic Cells | 38,400 |
| Maximale Taktfrequenz | 350 MHz |
| Number of I/O | 252 I/O |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm CMOS flash-based |
| Gehäuse / Bauform | FBGA-676 (676-ball BGA, 1.00 mm ball pitch) |
| Montagestil | SMD/SMT |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +70 C |
| Speed Grade | -1 |
| Packaging | Tray |
| Configuration Memory | Flash (non-volatile, live at power-up) |
| Analog Integration | Configurable analog blocks (mixed-signal Fusion architecture) |
| RoHS-Status | unknown |
M1AFS1500-1FGG676 fbga-676 (676-ball bga, 1.00 mm ball pitch) Pinbelegungsleitfaden
Pinbelegung für M1AFS1500-1FGG676 (fbga-676 (676-ball bga, 1.00 mm ball pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS1500-1FGG676.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS1500-1FGG676 ist geeignet für 6 Anwendungs: Industrial Automation and Motor Drive Control, Power Supply and System Health Monitoring, Aerospace and Defense Embedded Control, Portable and Battery-Powered Instrumentation, Networking and Communications Line Cards, Test and Measurement Equipment.
Industrial Automation and Motor Drive Control
The M1AFS1500-1FGG676 fits industrial automation because its 38,400 logic cells and 252 I/O provide the width needed for multi-axis PWM generation, encoder interfaces, and safety interlock logic in a single flash-based device rated to 350 MHz. Its Fusion analog blocks monitor motor winding temperature and DC bus voltage on-chip, replacing external supervisory ICs and reducing board area in drive cabinets. Because the configuration is stored in flash and live at power-up, the drive is operational within milliseconds of energization with no external boot device, improving fault recovery time. Use the industrial-temperature M1AFS1500-1FGG676I for factory-floor installations where ambient temperatures fall below 0C; the commercial part is suitable for enclosed, climate-controlled control rooms only.
Empfohlen
Power Supply and System Health Monitoring
Fusion's defining feature is monolithic configurable analog circuitry, making the M1AFS1500-1FGG676 a natural fit for power-supply supervision and board-level health monitoring. Voltage and temperature channels inside the 676-FBGA can threshold multiple rails and report out-of-range conditions to the programmable fabric, which then sequences shut-down or switches redundant supplies - functions that would otherwise require a microcontroller plus ADC plus supervisor chips. With 252 I/O available, the same device simultaneously implements hot-swap control, fan monitoring, and I2C/SMBus telemetry to a backplane manager. The 1.5 V core keeps monitoring-side power low, and the flash fabric retains its monitoring firmware through brown-outs, a key advantage over SRAM-based FPGAs that drop state when configuration is lost.
Empfohlen
Aerospace and Defense Embedded Control
The M1AFS1500-1FGG676 suits defense and aerospace embedded control where the flash-based Fusion fabric offers inherent resistance to configuration upsets and its live-at-power-up behavior simplifies system bring-up in size-, weight-, and power-constrained payloads. The 1.5M-gate, 38,400 logic cell capacity handles bus bridging (MIL-STD-style interfaces implemented in fabric), telemetry formatting, and payload sequencing, while on-chip clock management circuitry generates the multiple clock domains such systems require from a single reference. Design security features of flash FPGAs protect bitstream IP against readback. For space or extreme-temperature programs, consult Microchip for qualified variants; the commercial part specified here is intended for benign environments and ground equipment.
Empfohlen
Portable and Battery-Powered Instrumentation
Handheld and portable instruments benefit from the M1AFS1500-1FGG676's consolidation of digital glue logic, analog monitoring, and clock generation in one 130 nm flash device, cutting component count and quiescent power relative to an FPGA-plus-supervisor-plus-ADC solution. The 1.5 V core supply matches modern battery rail architectures, and 252 I/O supports display, touch, sensor, and communication interfaces without external bridge devices. Instant-on flash configuration lets the instrument respond immediately when the user presses power - no multi-hundred-millisecond bitstream load from external memory. Designers should keep the 0C to +70C rating in mind for outdoor instruments and select the M1AFS1500-1FGG676I variant where cold storage or winter field use is expected.
Empfohlen
Networking and Communications Line Cards
In networking equipment, the M1AFS1500-1FGG676 serves as a control-plane and glue-logic device on line cards, handling card identification, power sequencing, LED management, and low-speed data path bridging while a higher-density switching device handles the payload. Its 350 MHz capability and 38,400 logic cells comfortably implement I2C/SMBus masters, MDIO interfaces, and frame-counters, while on-chip analog channels report board temperature and rail health to the shelf manager. Flash-based live-at-power-up configuration allows the card to enumerate on the backplane before a host CPU boots, reducing system start time. The 676-ball FBGA with 1.00 mm pitch reflows on standard telecom PCB assemblies, and 252 I/O covers the full backplane connector edge.
Empfohlen
Test and Measurement Equipment
Bench instruments and automated test equipment use the M1AFS1500-1FGG676 for timing generation, trigger logic, and instrument-state sequencing. The 350 MHz maximum clock rate and 38,400 logic cells support hardware timestamping and fast trigger decision paths, while the Fusion analog blocks digitize slow channel-quality signals such as supply droop and internal temperature for self-test reporting. Non-volatile flash configuration means calibration tables and instrument personalities persist across power cycles without external memory reads, shortening boot to milliseconds - important in rack systems where hundreds of cards start simultaneously. Wide 252 I/O enables direct interfacing to relay matrices and sensor heads; verify per-bank I/O standards in the Fusion user reference manual during design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS1500-1FGG676 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS1500-1FGG676I | M1AFS1500-FGG676 | AFS1500-FGG676 | AFS1500-FG676 |
|---|---|---|---|---|---|
| Package | FBGA-676 (1.00 mm pitch) | FBGA-676 - same | FBGA-676 - same | FBGA-676 - same | FBGA-676 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology (legacy Microsemi) | Microchip Technology (legacy Microsemi) |
| Equivalent Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/O | 252 I/O | 252 I/O | 252 I/O | 252 I/O | 252 I/O |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead Finish (FG vs FGG) | FGG (RoHS-type lead finish) | FGG finish | FGG finish | FGG finish | FG finish (legacy) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature drop-in available (vs. M1AFS1500-1FGG676I)
- Mixed-signal integration vs pure digital FPGAs (vs. AFS1500-FG676)
- Non-volatile flash configuration (vs. M1AFS1500-FGG676)
Designhinweise
The 676-ball FBGA with 1.00 mm ball pitch requires a carefully controlled PCB stackup: use via-in-pad or dogbone fanout with 0.3 mm laser or mechanically drilled vias, and verify your fabricator's BGA capability before release. Power balls (core 1.5 V, aux, I/O bank supplies) should land on dedicated planes with multiple via arrays to minimize simultaneous-switching drop across the 252 user I/O. Follow Microchip/Microsemi Fusion PCB layout guidelines in the user reference manual for bank voltage assignment and keep configuration and JTAG balls routed short and away from noisy switching nodes.
Supply the 1.5 V core from a regulator with fast transient response; core current depends on logic utilization and toggle rates, so size the rail using Libero SoC power estimation for your specific design rather than a generic figure. Sequence core supply before or together with I/O bank supplies per the Fusion power-up requirements in the datasheet to avoid latch-up or I/O contention during boot. Because the flash fabric is live at power-up, I/O pins drive immediately - ensure connected devices tolerate early signal activity or add bus-hold/pull resistors.
Do not confuse commercial and industrial ordering codes: the M1AFS1500-1FGG676 is 0C to +70C only. Systems exposed below freezing must use M1AFS1500-1FGG676I. Also note the FG versus FGG lead-finish distinction seen on legacy Microsemi AFS1500 codes; FGG is the modern lead-free finish. When migrating designs between M1AFS and legacy AFS order codes, confirm speed-grade timing with a Libero SoC static timing analysis run, since the base (non -1) codes are not explicitly speed graded.
Compliance-Informationen
Compliance status not stated in the verified web data. The FGG suffix on Microsemi/Microchip order codes conventionally denotes lead-free finish, but this must be confirmed on the official Microchip product page before procurement decisions.
