M1AFS600-2FGG484 vs AFS600-2FGG484 Vergleich
Detaillierter Direktvergleich von M1AFS600-2FGG484 von Microchip Technology und AFS600-2FGG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS600-2FGG484 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FGG484 ✓ AktivMicrochip Technology
AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG484 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS600-2FGG484 | AFS600-2FGG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Family | Fusion (M1 variant with ARM Cortex-M1) | — |
| System Gates | 600000 | 600,000 gates |
| Logic Cells | 13824 | — |
| Total Memory Bits | [DATA_NEEDED: Total Memory Bits] | — |
| User I/O | 172 | — |
| Embedded Processor | ARM Cortex-M1 hard core | — |
| Programmable Technology | Flash-based (non-volatile) | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Core Voltage | 1.5 V | — |
| Speed Grade | -2 | — |
| Gehäuse | 484-ball FBGA (FGG484), 23x23x2.44 mm | — |
| Montageart | Surface Mount | Surface mount |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature] | 0 °C to +85 °C |
| Analog Features | Configurable analog blocks (mixed-signal FPGA) | — |
| On-chip Flash Memory | Large flash memory blocks integrated | — |
| Clock Management | Integrated clock generation and management circuitry | Comprehensive clock generation and management circuitry |
| RoHS-Status | Compliant (per Newark: RoHS Compliant: Yes) | — |
| Packaging | Tray | — |
| Device Type | — | Fusion mixed-signal field-programmable gate array (FPGA) |
| Logic Elements | — | 110,592 logic elements |
| User I/O Count | — | 172 I/O |
| Maximum Frequency | — | 1470.59 MHz |
| Versorgungsspannung | — | 1.5 V |
| Metal Layers | — | 7 layers |
| Package Type | — | 484-pin FBGA |
| Package Body Size | — | 23 x 23 mm |
| Package Pitch | — | 1.0 mm |
| Programmable Logic | — | Flash-based programmable logic |
| Analog Capability | — | Configurable embedded analog blocks |
| Configuration Memory | — | Large embedded flash-memory blocks |
| Packaging Type | — | Tray |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |