M1AFS600-2FGG484 vs AFS600-2FGG484 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS600-2FGG484 disebabkan oleh Microchip Technology dan AFS600-2FGG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS600-2FGG484 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FGG484 ✓ AktifMicrochip Technology
AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG484 ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS600-2FGG484 | AFS600-2FGG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Fusion (M1 variant with ARM Cortex-M1) | — |
| System Gates | 600000 | 600,000 gates |
| Logic Cells | 13824 | — |
| Total Memory Bits | [DATA_NEEDED: Total Memory Bits] | — |
| User I/O | 172 | — |
| Embedded Processor | ARM Cortex-M1 hard core | — |
| Programmable Technology | Flash-based (non-volatile) | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Core Voltage | 1.5 V | — |
| Speed Grade | -2 | — |
| Kemasan | 484-ball FBGA (FGG484), 23x23x2.44 mm | — |
| Jenis Pemasangan | Surface Mount | Surface mount |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature] | 0 °C to +85 °C |
| Analog Features | Configurable analog blocks (mixed-signal FPGA) | — |
| On-chip Flash Memory | Large flash memory blocks integrated | — |
| Clock Management | Integrated clock generation and management circuitry | Comprehensive clock generation and management circuitry |
| Status RoHS | Compliant (per Newark: RoHS Compliant: Yes) | — |
| Packaging | Tray | — |
| Device Type | — | Fusion mixed-signal field-programmable gate array (FPGA) |
| Logic Elements | — | 110,592 logic elements |
| User I/O Count | — | 172 I/O |
| Maximum Frequency | — | 1470.59 MHz |
| Tegangan Pemberi Arus | — | 1.5 V |
| Metal Layers | — | 7 layers |
| Package Type | — | 484-pin FBGA |
| Package Body Size | — | 23 x 23 mm |
| Package Pitch | — | 1.0 mm |
| Programmable Logic | — | Flash-based programmable logic |
| Analog Capability | — | Configurable embedded analog blocks |
| Configuration Memory | — | Large embedded flash-memory blocks |
| Packaging Type | — | Tray |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |