M1AFS600-2FGG484 vs AFS600-2FGG484 Comparaison
Comparaison détaillée côte à côte de M1AFS600-2FGG484 par Microchip Technology et AFS600-2FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS600-2FGG484 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FGG484 ✓ ActifMicrochip Technology
AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG484 ✓ ActifComparaison des spécifications
| Paramètre | M1AFS600-2FGG484 | AFS600-2FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Family | Fusion (M1 variant with ARM Cortex-M1) | — |
| System Gates | 600000 | 600,000 gates |
| Logic Cells | 13824 | — |
| Total Memory Bits | [DATA_NEEDED: Total Memory Bits] | — |
| User I/O | 172 | — |
| Embedded Processor | ARM Cortex-M1 hard core | — |
| Programmable Technology | Flash-based (non-volatile) | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Core Voltage | 1.5 V | — |
| Speed Grade | -2 | — |
| Boîtier | 484-ball FBGA (FGG484), 23x23x2.44 mm | — |
| Type de montage | Surface Mount | Surface mount |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | 0 °C to +85 °C |
| Analog Features | Configurable analog blocks (mixed-signal FPGA) | — |
| On-chip Flash Memory | Large flash memory blocks integrated | — |
| Clock Management | Integrated clock generation and management circuitry | Comprehensive clock generation and management circuitry |
| Statut RoHS | Compliant (per Newark: RoHS Compliant: Yes) | — |
| Packaging | Tray | — |
| Device Type | — | Fusion mixed-signal field-programmable gate array (FPGA) |
| Logic Elements | — | 110,592 logic elements |
| User I/O Count | — | 172 I/O |
| Maximum Frequency | — | 1470.59 MHz |
| Tension d'alimentation | — | 1.5 V |
| Metal Layers | — | 7 layers |
| Package Type | — | 484-pin FBGA |
| Package Body Size | — | 23 x 23 mm |
| Package Pitch | — | 1.0 mm |
| Programmable Logic | — | Flash-based programmable logic |
| Analog Capability | — | Configurable embedded analog blocks |
| Configuration Memory | — | Large embedded flash-memory blocks |
| Packaging Type | — | Tray |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |