M1AFS600-2FGG484 vs AFS600-2FGG484 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS600-2FGG484 sa pamamagitan ng Microchip Technology at AFS600-2FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
M1AFS600-2FGG484 M1AFS600-2FGG484 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FGG484 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FGG484 ✓ Nakahanda
Microchip Technology
AFS600-2FGG484 AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro M1AFS600-2FGG484 AFS600-2FGG484
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Fusion (M1 variant with ARM Cortex-M1) —
System Gates 600000 600,000 gates
Logic Cells 13824 —
Total Memory Bits [DATA_NEEDED: Total Memory Bits] —
User I/O 172 —
Embedded Processor ARM Cortex-M1 hard core —
Programmable Technology Flash-based (non-volatile) —
Process Technology 130 nm 130 nm CMOS
Core Voltage 1.5 V —
Speed Grade -2 —
Packhaging 484-ball FBGA (FGG484), 23x23x2.44 mm —
Uri ng Pagpapasok Surface Mount Surface mount
Temperature na Operasyon [DATA_NEEDED: Operating Temperature] 0 °C to +85 °C
Analog Features Configurable analog blocks (mixed-signal FPGA) —
On-chip Flash Memory Large flash memory blocks integrated —
Clock Management Integrated clock generation and management circuitry Comprehensive clock generation and management circuitry
Tindminan RoHS Compliant (per Newark: RoHS Compliant: Yes) —
Packaging Tray —
Device Type — Fusion mixed-signal field-programmable gate array (FPGA)
Logic Elements — 110,592 logic elements
User I/O Count — 172 I/O
Maximum Frequency — 1470.59 MHz
Volte ng Pagbibigay — 1.5 V
Metal Layers — 7 layers
Package Type — 484-pin FBGA
Package Body Size — 23 x 23 mm
Package Pitch — 1.0 mm
Programmable Logic — Flash-based programmable logic
Analog Capability — Configurable embedded analog blocks
Configuration Memory — Large embedded flash-memory blocks
Packaging Type — Tray
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita