M7AFS600-1FGG256 vs M7AFS600-FG256 Vergleich
Detaillierter Direktvergleich von M7AFS600-1FGG256 von Microchip Technology und M7AFS600-FG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 NrndMicrochip Technology
M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip
M7AFS600-FG256 ✓ AktivSpezifikationsvergleich
| Parameter | M7AFS600-1FGG256 | M7AFS600-FG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $92,00 | $198,75 |
| Family | Fusion (Mixed-Signal FPGA) | — |
| System Gates | 600K | 600000 gates |
| Fabric Elements (Registers) | 110592 | — |
| Embedded Processor | 32-bit ARM CoreMP7 (hard core) | ARM CoreMP7 |
| Speed Grade | -1 | — |
| Process Technology | 130 nm flash | 130 nm Flash |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Gehäuse | 256-LBGA (FPBGA-256, 17x17 mm) | — |
| Montageart | Surface Mount | — |
| Configuration | Flash-based, nonvolatile, live at power-up | — |
| Betriebstemperatur | 0C to +70C (commercial) | 0 C to +70 C (commercial) |
| Maximum Frequency | [DATA_NEEDED: maximum fabric/system frequency] | — |
| Number of I/O | [DATA_NEEDED: user I/O count for FGG256] | — |
| Analog Peripherals | [DATA_NEEDED: ADC channel count and resolution] | — |
| On-chip RTC / POR | [DATA_NEEDED: RTC/POR availability details] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | M7AFS600 (Fusion) |
| D Flip-Flops / Registers | — | 110592 |
| User I/O | — | 119 |
| Configuration Type | — | Flash-based, non-volatile |
| Maximum Operating Frequency | — | 1098.9 MHz (per FPGAkey listing) |
| Gehäuse / Bauform | — | 256-LBGA (FBGA), 17x17x1.7 mm |
| Terminal Form | — | Ball (SMD/SMT) |
| Montagestil | — | Surface Mount |
| Packaging | — | Tray |
| Product Type | — | Mixed-Signal FPGA |