M7AFS600-FGG256I vs AFS600-FGG256K Vergleich
Detaillierter Direktvergleich von M7AFS600-FGG256I von Microchip Technology und AFS600-FGG256K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ AktivMicrochip Technology
AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology
AFS600-FGG256K ✓ AktivSpezifikationsvergleich
| Parameter | M7AFS600-FGG256I | AFS600-FGG256K |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600,000 gates |
| User I/O | 119 | 119 I/O |
| Gehäuse | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm flash-based CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| Betriebstemperaturbereich | -40C to +85C (industrial grade standard range) | — |
| Montageart | Surface Mount | Surface mount |
| Packaging | Tray | — |
| MSL-Level | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Device Type | — | Fusion mixed-signal field-programmable gate array (FPGA) |
| Embedded Flash Memory | — | 110,592 bits |
| Versorgungsspannung | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 256-pin FBGA |
| Package Ball Pitch | — | 1.0 mm |
| Total Pins | — | 256 pins |
| Betriebstemperatur | — | 0°C to +70°C |
| Metal Layers | — | 7 layers |
| Configuration Memory Type | — | Embedded nonvolatile flash |
| Power-Off Data Retention | — | Yes |
| Live at Power-Up | — | Yes |
| Listed Maximum Frequency | — | 1098.9 MHz |
| RoHS-Status | — | unknown |
| REACH Status | — | unknown |