M7AFS600-FGG256I vs AFS600-FGG256K Comparaison
Comparaison détaillée côte à côte de M7AFS600-FGG256I par Microchip Technology et AFS600-FGG256K par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ ActifMicrochip Technology
AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology
AFS600-FGG256K ✓ ActifComparaison des spécifications
| Paramètre | M7AFS600-FGG256I | AFS600-FGG256K |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600,000 gates |
| User I/O | 119 | 119 I/O |
| Boîtier | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm flash-based CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| Plage de température de fonctionnement | -40C to +85C (industrial grade standard range) | — |
| Type de montage | Surface Mount | Surface mount |
| Packaging | Tray | — |
| Niveau MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Device Type | — | Fusion mixed-signal field-programmable gate array (FPGA) |
| Embedded Flash Memory | — | 110,592 bits |
| Tension d'alimentation | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 256-pin FBGA |
| Package Ball Pitch | — | 1.0 mm |
| Total Pins | — | 256 pins |
| Température de fonctionnement | — | 0°C to +70°C |
| Metal Layers | — | 7 layers |
| Configuration Memory Type | — | Embedded nonvolatile flash |
| Power-Off Data Retention | — | Yes |
| Live at Power-Up | — | Yes |
| Listed Maximum Frequency | — | 1098.9 MHz |
| Statut RoHS | — | unknown |
| REACH Status | — | unknown |