M7AFS600-FGG256I vs AFS600-FGG256K Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-FGG256I sa pamamagitan ng Microchip Technology at AFS600-FGG256K sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Nakahanda
Microchip Technology
AFS600-FGG256K AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology

AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology

AFS600-FGG256K ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro M7AFS600-FGG256I AFS600-FGG256K
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Fusion Mixed-Signal FPGA —
System Gates 600K 600,000 gates
User I/O 119 119 I/O
Packhaging 256-LBGA (FBGA), 1 mm ball pitch —
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm flash-based CMOS
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
Hanay ng Temperature na Operasyon -40C to +85C (industrial grade standard range) —
Uri ng Pagpapasok Surface Mount Surface mount
Packaging Tray —
Level ng MSL [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Device Type — Fusion mixed-signal field-programmable gate array (FPGA)
Embedded Flash Memory — 110,592 bits
Volte ng Pagbibigay — 1.5 V
Logic Family — CMOS
Package Type — 256-pin FBGA
Package Ball Pitch — 1.0 mm
Total Pins — 256 pins
Temperature na Operasyon — 0°C to +70°C
Metal Layers — 7 layers
Configuration Memory Type — Embedded nonvolatile flash
Power-Off Data Retention — Yes
Live at Power-Up — Yes
Listed Maximum Frequency — 1098.9 MHz
Tindminan RoHS — unknown
REACH Status — unknown

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