M7AFS600-FGG256I vs AFS600-FGG256K 对比

详细并排对比 M7AFS600-FGG256I 出自 Microchip Technology 和 AFS600-FGG256K 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ 量产中
Microchip Technology
AFS600-FGG256K AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology

AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology

AFS600-FGG256K ✓ 量产中

规格对比

参数 M7AFS600-FGG256I AFS600-FGG256K
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Family Fusion Mixed-Signal FPGA —
System Gates 600K 600,000 gates
User I/O 119 119 I/O
封装 256-LBGA (FBGA), 1 mm ball pitch —
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm flash-based CMOS
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
工作温度范围 -40C to +85C (industrial grade standard range) —
安装类型 Surface Mount Surface mount
Packaging Tray —
MSL 等级 [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Device Type — Fusion mixed-signal field-programmable gate array (FPGA)
Embedded Flash Memory — 110,592 bits
电源电压 — 1.5 V
Logic Family — CMOS
Package Type — 256-pin FBGA
Package Ball Pitch — 1.0 mm
Total Pins — 256 pins
工作温度 — 0°C to +70°C
Metal Layers — 7 layers
Configuration Memory Type — Embedded nonvolatile flash
Power-Off Data Retention — Yes
Live at Power-Up — Yes
Listed Maximum Frequency — 1098.9 MHz
RoHS 状态 — unknown
REACH Status — unknown

数据手册与资源

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