MC9S08QE8CWL vs MC9S08SH8MTG Vergleich

Detaillierter Direktvergleich von MC9S08QE8CWL von NXP Semiconductors und MC9S08SH8MTG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter MC9S08QE8CWL MC9S08SH8MTG
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,33 $1,55
Core Processor HCS08 (S08) HCS08 (S08 core, 8-bit CISC)
Core Size 8-bit 8-bit
Core Architecture CISC, Harvard, 3-stage pipeline —
Maximum CPU Frequency 20 MHz at 1.8 V; 50.33 MHz bus at 2.1 V 40 MHz
Program Memory (Flash) 8 KB (8K x 8) 8 KB (8K x 8)
RAM 512 B —
Supply Voltage (VDD) 1.8 V to 3.6 V —
I/O Pins 28 —
Gehäuse 28-pin SOIC W (7 mm x 7 mm, 1.40 mm height, 0.80 mm pitch) 16-pin TSSOP (Tape and Reel)
Betriebstemperatur -40 C to +85 C [DATA_NEEDED: operating temperature range]
Connectivity I2C, LINbus, SCI, SPI I2C, LINbus, SCI, SPI
Peripherals LVD, PWM, 16-bit Timer (TPM), BDM LVD, POR, PWM, WDT, ACMP
PWM Channels Up to 6 —
Debug Interface Single-wire Background Debug Mode (BDM) BDM (Background Debug Mode)
ROM Type Flash —
Montageart Surface Mount Surface Mount
RoHS-Status Compliant (per NXP product page) —
Series S08QE Flexis —
Montagestil Surface Mount —
Family MC9S08 —
RAM Size — 512 x 8 (512 B)
EEPROM Size — Not present (Flash-only)
Operating Voltage Range — 2.7 V to 5.5 V
Number of I/O Pins — 13
ADC — 12-channel, 10-bit, 2.5 µs conversion
Temperature Sensor — Internal (ADC channel)
Interrupt Sources — Up to 32
Lead-Free / RoHS — Yes (per Mouser listing)

Datenblätter & Ressourcen

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