MC9S08QE8CWL vs MC9S08SH8MTG Comparação

Comparação detalhada lado a lado de MC9S08QE8CWL por NXP Semiconductors e MC9S08SH8MTG por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro MC9S08QE8CWL MC9S08SH8MTG
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $3,33 $1,55
Core Processor HCS08 (S08) HCS08 (S08 core, 8-bit CISC)
Core Size 8-bit 8-bit
Core Architecture CISC, Harvard, 3-stage pipeline —
Maximum CPU Frequency 20 MHz at 1.8 V; 50.33 MHz bus at 2.1 V 40 MHz
Program Memory (Flash) 8 KB (8K x 8) 8 KB (8K x 8)
RAM 512 B —
Supply Voltage (VDD) 1.8 V to 3.6 V —
I/O Pins 28 —
Encapsulamento 28-pin SOIC W (7 mm x 7 mm, 1.40 mm height, 0.80 mm pitch) 16-pin TSSOP (Tape and Reel)
Temperatura de operação -40 C to +85 C [DATA_NEEDED: operating temperature range]
Connectivity I2C, LINbus, SCI, SPI I2C, LINbus, SCI, SPI
Peripherals LVD, PWM, 16-bit Timer (TPM), BDM LVD, POR, PWM, WDT, ACMP
PWM Channels Up to 6 —
Debug Interface Single-wire Background Debug Mode (BDM) BDM (Background Debug Mode)
ROM Type Flash —
Tipo de montagem Surface Mount Surface Mount
Status RoHS Compliant (per NXP product page) —
Series S08QE Flexis —
Estilo de montagem Surface Mount —
Family MC9S08 —
RAM Size — 512 x 8 (512 B)
EEPROM Size — Not present (Flash-only)
Operating Voltage Range — 2.7 V to 5.5 V
Number of I/O Pins — 13
ADC — 12-channel, 10-bit, 2.5 µs conversion
Temperature Sensor — Internal (ADC channel)
Interrupt Sources — Up to 32
Lead-Free / RoHS — Yes (per Mouser listing)

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