MC9S08SH4CTJ vs MC9S08SH32CTJ Vergleich
Detaillierter Direktvergleich von MC9S08SH4CTJ von NXP Semiconductors und MC9S08SH32CTJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08SH4CTJ | MC9S08SH32CTJ |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,85 | $1,52 |
| Core Architecture | HCS08 (enhanced 8-bit) | — |
| CPU Bit Width | 8-bit | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor | — |
| Timers | MTIM, RTI, TPM (PWM) | MTIM (modulo timer) |
| Communication Interfaces | SCI/UART, SPI, I2C | — |
| Analog Comparator | Yes (integrated) | — |
| Gehäuse | 20-pin TSSOP | 20-TSSOP |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40 C to +85 C (industrial, TJ suffix implied) | — |
| Low-Power Modes | STOP, WAIT with fast wake-up | — |
| Debug Interface | Single-wire BDM (background debug mode) | Single-wire background debug (BKGD) |
| Instruction Set | HC08 with BGND extension | — |
| Interrupt Sources | Up to 32 | — |
| RoHS-Status | Compliant | — |
| Core Processor | — | HCS08 (S08) |
| Core Size | — | 8-Bit |
| Maximale Taktfrequenz | — | 40 MHz |
| Flash Memory | — | 32 KB (32K x 8) |
| RAM Size | — | 1 KB |
| Versorgungsspannung | — | 3.3 V / 5 V |
| Number of I/O | — | up to 16 GPIO |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 12-channel |
| Interrupt/Reset Sources | — | up to 32 |
| On-Chip Debug Module | — | ICE with 2 comparators, 9 trigger modes, 8-deep FIFO |
| Qualification | — | AEC-Q100 |
| Packaging | — | Tube |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |