MC9S08SH4MPJ vs MC9S08SH4MFK Vergleich
Detaillierter Direktvergleich von MC9S08SH4MPJ von NXP Semiconductors und MC9S08SH4MFK von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08SH4MPJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP DIP-20
MC9S08SH4MPJ ✗ Abgekündigt
Spezifikationsvergleich
| Parameter | MC9S08SH4MPJ | MC9S08SH4MFK |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,50 | $2,15 |
| Core | HCS08 (enhanced 8-bit) | HCS08 (8-bit) |
| CPU Architecture | CISC, HC08 instruction set with BGND | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Flash Memory | 4 KB | — |
| RAM | 256 B | — |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40C to +125C (automotive grade) | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| ADC | 12-channel, 10-bit, 2.5 us conversion time | 12-channel, 10-bit, 2.5 us conversion |
| Interner Temperatursensor | Yes | — |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Interrupt Sources | Up to 32 | — |
| Gehäuse | 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm) | — |
| Montageart | Through-Hole (THT) | Surface Mount |
| Temperature Grade | Automotive | — |
| Compatibility Family | S08SH, software/tool compatible with S08SG | — |
| Debug | Background Debug Mode (BGND) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| RAM Size | — | 256 B |
| Maximum CPU Clock | — | 40 MHz |
| Number of I/O Pins | — | 17 |
| Gehäuse / Bauform | — | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Instruction Set | — | HC08 with BGND instruction |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |