MC9S08SH4MPJ vs MC9S08SH4MFK Comparação
Comparação detalhada lado a lado de MC9S08SH4MPJ por NXP Semiconductors e MC9S08SH4MFK por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08SH4MPJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP DIP-20
MC9S08SH4MPJ ✗ Fim de vida
Comparação de especificações
| Parâmetro | MC9S08SH4MPJ | MC9S08SH4MFK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $13,50 | $2,15 |
| Core | HCS08 (enhanced 8-bit) | HCS08 (8-bit) |
| CPU Architecture | CISC, HC08 instruction set with BGND | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Flash Memory | 4 KB | — |
| RAM | 256 B | — |
| Tensão de alimentação | 2.7 V to 5.5 V | — |
| Temperatura de operação | -40C to +125C (automotive grade) | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| ADC | 12-channel, 10-bit, 2.5 us conversion time | 12-channel, 10-bit, 2.5 us conversion |
| Sensor de temperatura interno | Yes | — |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Interrupt Sources | Up to 32 | — |
| Encapsulamento | 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm) | — |
| Tipo de montagem | Through-Hole (THT) | Surface Mount |
| Temperature Grade | Automotive | — |
| Compatibility Family | S08SH, software/tool compatible with S08SG | — |
| Debug | Background Debug Mode (BGND) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| RAM Size | — | 256 B |
| Maximum CPU Clock | — | 40 MHz |
| Number of I/O Pins | — | 17 |
| Encapsulamento / Caixa | — | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Instruction Set | — | HC08 with BGND instruction |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |