MC9S12DG256BCPV vs MC9S12DG256CVPV Vergleich
Detaillierter Direktvergleich von MC9S12DG256BCPV von NXP Semiconductors und MC9S12DG256CVPV von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DG256CVPV - 16-Bit 25MHz HCS12 MCU, 256KB Flash | NXP / Freescale
MC9S12DG256CVPV NrndSpezifikationsvergleich
| Parameter | MC9S12DG256BCPV | MC9S12DG256CVPV |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,40 | $12,40 |
| Core Processor | HCS12 | — |
| Core Size | 16-bit | — |
| Core Architecture | CISC | HCS12 (16-bit CISC) |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| Program Memory Type | Flash | — |
| RAM Size | 12 KB | — |
| EEPROM Size | 4 KB x 8 | — |
| Number of I/O | 91 | — |
| Versorgungsspannung | 2.5 V / 5 V | 2.97 V to 5.5 V |
| Oscillator Type | Internal | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| Gehäuse / Bauform | 112-LQFP (20 x 20 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Core Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| Datenbusbreite | — | 16-bit |
| Gehäuse | — | 112-LQFP (20x20 mm) |
| I/O Pins | — | 91 |
| ADC | — | 2x 8-channel, 10-bit |
| PWM Channels | — | 8 |
| Capture Timer | — | 8-channel enhanced |
| Communication Interfaces | — | 2x SCI, CAN, SPI, I²C |
| MSL-Level | — | 3 (168 hours) |