MC9S12DG256BCPV vs MC9S12DG256CVPV Comparación
Comparación detallada lado a lado de MC9S12DG256BCPV por NXP Semiconductors y MC9S12DG256CVPV por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DG256CVPV - 16-Bit 25MHz HCS12 MCU, 256KB Flash | NXP / Freescale
MC9S12DG256CVPV NrndComparación de especificaciones
| Parámetro | MC9S12DG256BCPV | MC9S12DG256CVPV |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,40 | $12,40 |
| Core Processor | HCS12 | — |
| Core Size | 16-bit | — |
| Core Architecture | CISC | HCS12 (16-bit CISC) |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| Program Memory Type | Flash | — |
| RAM Size | 12 KB | — |
| EEPROM Size | 4 KB x 8 | — |
| Number of I/O | 91 | — |
| Tensión de alimentación | 2.5 V / 5 V | 2.97 V to 5.5 V |
| Oscillator Type | Internal | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| Encapsulado / Carcasa | 112-LQFP (20 x 20 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Core Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| Ancho del bus de datos | — | 16-bit |
| Encapsulado | — | 112-LQFP (20x20 mm) |
| I/O Pins | — | 91 |
| ADC | — | 2x 8-channel, 10-bit |
| PWM Channels | — | 8 |
| Capture Timer | — | 8-channel enhanced |
| Communication Interfaces | — | 2x SCI, CAN, SPI, I²C |
| Nivel MSL | — | 3 (168 hours) |