MC9S12DP512MPVE vs MC9S12DG256CCPV Vergleich
Detaillierter Direktvergleich von MC9S12DP512MPVE von NXP Semiconductors und MC9S12DG256CCPV von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndSpezifikationsvergleich
| Parameter | MC9S12DP512MPVE | MC9S12DG256CCPV |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,45 | $18,20 |
| Core Processor | HCS12 (CPU12), 16-bit CISC | — |
| Core Size | 16-bit | — |
| Maximale Taktfrequenz | 25 MHz | — |
| Program Memory Size | 512 KB (512K x 8) Flash | — |
| RAM Size | 12 KB | 12 KB |
| EEPROM Size | 4 KB | 4 KB |
| Number of I/O | 91 general-purpose I/O | — |
| ADC Resolution | 10-bit | — |
| Number of ADC Channels | 16 (two 8-channel 10-bit ADCs) | — |
| Serial Interfaces | 2x SCI (asynchronous serial), IIC, SPI | — |
| Timers | 8-channel enhanced capture timer (IC/OC) | Enhanced Capture Timer (ECT) + watchdog |
| PWM Channels | 8-channel pulse-width modulator | 8 channels |
| Gehäuse | 112-LQFP (20x20 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Program Memory Type | FLASH (0.25 um) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | — |
| Lebenszyklusstatus | Active | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Betriebstemperaturbereich | — | -40 °C to +85 °C (industrial) |
| Gehäuse / Bauform | — | 112-LQFP (20 x 20 mm) |
| ADC | — | 8-channel, 10-bit |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| RoHS-Status | — | Compliant |
| MSL-Level | — | 3 (168 hours, JEDEC J-STD-020) |