MC9S12DP512MPVE vs MC9S12DG256CCPV Comparación
Comparación detallada lado a lado de MC9S12DP512MPVE por NXP Semiconductors y MC9S12DG256CCPV por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndComparación de especificaciones
| Parámetro | MC9S12DP512MPVE | MC9S12DG256CCPV |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,45 | $18,20 |
| Core Processor | HCS12 (CPU12), 16-bit CISC | — |
| Core Size | 16-bit | — |
| Frecuencia de reloj máxima | 25 MHz | — |
| Program Memory Size | 512 KB (512K x 8) Flash | — |
| RAM Size | 12 KB | 12 KB |
| EEPROM Size | 4 KB | 4 KB |
| Number of I/O | 91 general-purpose I/O | — |
| ADC Resolution | 10-bit | — |
| Number of ADC Channels | 16 (two 8-channel 10-bit ADCs) | — |
| Serial Interfaces | 2x SCI (asynchronous serial), IIC, SPI | — |
| Timers | 8-channel enhanced capture timer (IC/OC) | Enhanced Capture Timer (ECT) + watchdog |
| PWM Channels | 8-channel pulse-width modulator | 8 channels |
| Encapsulado | 112-LQFP (20x20 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Program Memory Type | FLASH (0.25 um) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | — |
| Estado del ciclo de vida | Active | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Rango de temperatura de funcionamiento | — | -40 °C to +85 °C (industrial) |
| Encapsulado / Carcasa | — | 112-LQFP (20 x 20 mm) |
| ADC | — | 8-channel, 10-bit |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| Estado RoHS | — | Compliant |
| Nivel MSL | — | 3 (168 hours, JEDEC J-STD-020) |