MC9S12DP512MPVE vs MC9S12DG256CCPV Comparison
Detailed side-by-side comparison of MC9S12DP512MPVE by NXP Semiconductors and MC9S12DG256CCPV by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndSpecification Comparison
| Parameter | MC9S12DP512MPVE | MC9S12DG256CCPV |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.45 | $18.20 |
| Core Processor | HCS12 (CPU12), 16-bit CISC | — |
| Core Size | 16-bit | — |
| Maximum Clock Frequency | 25 MHz | — |
| Program Memory Size | 512 KB (512K x 8) Flash | — |
| RAM Size | 12 KB | 12 KB |
| EEPROM Size | 4 KB | 4 KB |
| Number of I/O | 91 general-purpose I/O | — |
| ADC Resolution | 10-bit | — |
| Number of ADC Channels | 16 (two 8-channel 10-bit ADCs) | — |
| Serial Interfaces | 2x SCI (asynchronous serial), IIC, SPI | — |
| Timers | 8-channel enhanced capture timer (IC/OC) | Enhanced Capture Timer (ECT) + watchdog |
| PWM Channels | 8-channel pulse-width modulator | 8 channels |
| Package | 112-LQFP (20x20 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Program Memory Type | FLASH (0.25 um) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage | [DATA_NEEDED: supply voltage range] | — |
| Lifecycle Status | Active | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Operating Temperature Range | — | -40 °C to +85 °C (industrial) |
| Package / Case | — | 112-LQFP (20 x 20 mm) |
| ADC | — | 8-channel, 10-bit |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| RoHS Status | — | Compliant |
| MSL Level | — | 3 (168 hours, JEDEC J-STD-020) |