MC9S12XA512CAL vs MC9S12XDP512MAL Vergleich
Detaillierter Direktvergleich von MC9S12XA512CAL von NXP Semiconductors und MC9S12XDP512MAL von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12XDP512MAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP
MC9S12XDP512MAL NrndSpezifikationsvergleich
| Parameter | MC9S12XA512CAL | MC9S12XDP512MAL |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,10 | $16,40 |
| Core | HCS12X (enhanced HCS12, CISC) | — |
| Maximum CPU Frequency | 80 MHz | — |
| Internal Bus Frequency | 40 MHz | — |
| Program Flash | 512 KB (512K x 8) | — |
| RAM | 32 KB | — |
| EEPROM | 4 KB | — |
| Datenbusbreite | 16-bit | — |
| ADC | 16-channel, 10-bit | — |
| General-Purpose I/O | Up to 91 | — |
| Communication Interfaces | CAN (MSCAN), SCI, SPI, IIC | — |
| Operating Voltage | 2.5 V / 5 V | — |
| Betriebstemperatur | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Program Memory Size | — | 512 KB (512K x 8) Flash |
| RAM Size | — | 32 KB |
| EEPROM Size | — | 4 KB |
| Maximum Speed | — | 80 MHz |
| Bus Speed | — | 40 MHz |
| Number of I/O | — | 91 |
| Versorgungsspannung | — | 2.35 V to 2.75 V core |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT, ECT, ADC |
| ADC Channels | — | 24-channel 10-bit |