MC9S12XA512CAL vs MC9S12XDP512MAL Comparación
Comparación detallada lado a lado de MC9S12XA512CAL por NXP Semiconductors y MC9S12XDP512MAL por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12XDP512MAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP
MC9S12XDP512MAL NrndComparación de especificaciones
| Parámetro | MC9S12XA512CAL | MC9S12XDP512MAL |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,10 | $16,40 |
| Core | HCS12X (enhanced HCS12, CISC) | — |
| Maximum CPU Frequency | 80 MHz | — |
| Internal Bus Frequency | 40 MHz | — |
| Program Flash | 512 KB (512K x 8) | — |
| RAM | 32 KB | — |
| EEPROM | 4 KB | — |
| Ancho del bus de datos | 16-bit | — |
| ADC | 16-channel, 10-bit | — |
| General-Purpose I/O | Up to 91 | — |
| Communication Interfaces | CAN (MSCAN), SCI, SPI, IIC | — |
| Operating Voltage | 2.5 V / 5 V | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Program Memory Size | — | 512 KB (512K x 8) Flash |
| RAM Size | — | 32 KB |
| EEPROM Size | — | 4 KB |
| Maximum Speed | — | 80 MHz |
| Bus Speed | — | 40 MHz |
| Number of I/O | — | 91 |
| Tensión de alimentación | — | 2.35 V to 2.75 V core |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT, ECT, ADC |
| ADC Channels | — | 24-channel 10-bit |