MC9S12XDT256CAG vs MC9S12XDT256CAA Vergleich
Detaillierter Direktvergleich von MC9S12XDT256CAG von NXP Semiconductors und MC9S12XDT256CAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP
MC9S12XDT256CAG ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | MC9S12XDT256CAG | MC9S12XDT256CAA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,40 | $10,83 |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | — |
| Program Memory | 256 KB Flash | — |
| RAM | 16 KB | — |
| EEPROM | 4 KB | — |
| Maximum CPU Frequency | 80 MHz | — |
| Supply Voltage - Core | 2.35 V to 2.75 V | — |
| Supply Voltage - I/O | 4.5 V to 5.5 V | — |
| I/O Pins | 119 | — |
| Betriebstemperatur | -40C to +85C | -40C to +85C (TA) |
| Gehäuse | 144-pin LQFP (20x20 mm) | — |
| CAN Controllers (MSCAN) | 5 (CAN 2.0 A/B) | — |
| SCI / SPI | Yes | — |
| ADC | 16-channel, 10-bit | — |
| PWM Channels | 8 | — |
| Timers | ECT (Enhanced Capture Timer) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Lebenszyklusstatus | No Longer Manufactured (per NXP product page) | — |
| Core Processor | — | HCS12X (S12XD) |
| Core Size | — | 16-Bit |
| Speed | — | 80 MHz |
| Flash Memory | — | 256KB (256K x 8) |
| Number of I/O | — | 59 |
| Supply Voltage (Vdd) | — | 2.35 V to 5.5 V (per distributor listing) |
| Data Converters | — | A/D 10-bit |
| Gehäuse / Bauform | — | 80-QFP (14x14 mm) |
| Supplier Device Package | — | 80-QFP (14x14) |
| Terminal Form | — | Gull Wing |
| Package Shape | — | Square (QFP) |
| Packaging Method | — | Tray |
| Series | — | HCS12X / S12XD Family (MC9S12XDT256) |
| Temperature Grade | — | Industrial |
| Lifecycle Status (NXP) | — | NRND (Not Recommended for New Designs) |
| EEPROM Size | — | [DATA_NEEDED: EEPROM Size] |
| SRAM Size | — | [DATA_NEEDED: SRAM Size] |
| Peripherals (CAN/LIN/SPI/SCI) | — | [DATA_NEEDED: peripheral counts] |