MC9S12XDT256CAG vs MC9S12XDT256CAA Comparação

Comparação detalhada lado a lado de MC9S12XDT256CAG por NXP Semiconductors e MC9S12XDT256CAA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12XDT256CAG MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG ⚠ Última compra
NXP Semiconductors
MC9S12XDT256CAA MC9S12XDT256CAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256CAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256CAA Nrnd

Comparação de especificações

Parâmetro MC9S12XDT256CAG MC9S12XDT256CAA
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Última compra NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $17,40 $10,83
Core HCS12X (16-bit CISC with XGATE co-processor) —
Program Memory 256 KB Flash —
RAM 16 KB —
EEPROM 4 KB —
Maximum CPU Frequency 80 MHz —
Supply Voltage - Core 2.35 V to 2.75 V —
Supply Voltage - I/O 4.5 V to 5.5 V —
I/O Pins 119 —
Temperatura de operação -40C to +85C -40C to +85C (TA)
Encapsulamento 144-pin LQFP (20x20 mm) —
CAN Controllers (MSCAN) 5 (CAN 2.0 A/B) —
SCI / SPI Yes —
ADC 16-channel, 10-bit —
PWM Channels 8 —
Timers ECT (Enhanced Capture Timer) —
Tipo de montagem Surface Mount Surface Mount
Nível MSL [DATA_NEEDED: MSL level] —
Status RoHS [DATA_NEEDED: RoHS status] —
Debug Interface BDM (Background Debug Mode) —
Status do ciclo de vida No Longer Manufactured (per NXP product page) —
Core Processor — HCS12X (S12XD)
Core Size — 16-Bit
Speed — 80 MHz
Flash Memory — 256KB (256K x 8)
Number of I/O — 59
Supply Voltage (Vdd) — 2.35 V to 5.5 V (per distributor listing)
Data Converters — A/D 10-bit
Encapsulamento / Caixa — 80-QFP (14x14 mm)
Supplier Device Package — 80-QFP (14x14)
Terminal Form — Gull Wing
Package Shape — Square (QFP)
Packaging Method — Tray
Series — HCS12X / S12XD Family (MC9S12XDT256)
Temperature Grade — Industrial
Lifecycle Status (NXP) — NRND (Not Recommended for New Designs)
EEPROM Size — [DATA_NEEDED: EEPROM Size]
SRAM Size — [DATA_NEEDED: SRAM Size]
Peripherals (CAN/LIN/SPI/SCI) — [DATA_NEEDED: peripheral counts]

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