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NXP Semiconductors

MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

Teilenummer: MC9S12XDT256CAG ⚠ Letzte Bestellmöglichkeit
Auf Lager Versand in 1–3 Werktagen
2.35 V to 2.75 V Vdss 144-pin LQFP (20x20 mm) Package 80 MHz Speed 256 KB Flash Memory
Ab $17.4 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $28.5 $28,50
10 $25.1 $251,00
100 $21.75 $2.175,00
500 $19.2 $9.600,00
1.000 $17.4 $17.400,00
ℹ️ Alle Preise sind in USD

MC9S12XDT256CAG Übersicht

The NXP MC9S12XDT256CAG is a 16-bit HCS12X microcontroller with 256KB program Flash, 80 MHz CPU, and 144-pin LQFP (20x20) package. The 'CAG' suffix denotes the 144-LQFP operating range -40C to +85C, targeted at automotive multiplexing and body-electronics applications.

An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO on a single die. The MC9S12XDT256CAG belongs to the S12XD family that delivers 32-bit-like performance while preserving the HCS12 instruction set for code reuse. As a derivative of the broader Freescale/NXP HCS12 lineage, it sits in the category: MCU -> microcontroller -> embedded processor -> semiconductor.

Key features include 256KB Flash, 16KB RAM, 4KB EEPROM, 119 I/O lines, 8/16-bit PWM, up to 8 timer channels, MSCAN (CAN 2.0A/B) controller, SCI/SPI serial interfaces, 16-channel 10-bit ADC, and a 5V-tolerant I/O. The XGATE co-processor offloads interrupt-driven tasks from the main CPU, effectively doubling throughput for I/O-bound automotive workloads. Internal Phase-Locked Loop (IPLL) generates the 80 MHz bus clock from an external 4-16 MHz crystal.

The architecture uses an enhanced 16-bit CISC core with 20-bit ALU extensions, instruction queue, and enhanced indexed addressing. XGATE is an independent RISC-style peripheral co-processor that runs concurrent to the CPU and is ideal for processing CAN, LIN, and SPI traffic in real time. The device operates from a single 2.5V core / 5V I/O supply pair, simplifying automotive 12V rail design.

Typical applications include automotive body controllers (BCM), gateway modules, instrument clusters, HVAC control, door modules, seat controllers, and industrial CAN-node controllers. The 5V I/O tolerance and on-chip MSCAN make it ideal for any 12V-board automotive multiplexing network.

When designing, pay attention to decoupling: place 100nF ceramic + 4.7uF bulk on VDDR/VSS, plus 10uF on VDDX/VSSX. Use NXP's BDM (Background Debug Mode) interface via the BKGD pin for in-circuit programming. The PLL reference loop filter (XFC pin) capacitor selection is critical for jitter performance.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in-Alternativen für MC9S12XDT256CAG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12XDT256CAG (gleiche Bauform und Footprint) – abweichend in Package, Core Processor, Supply Voltage, Operating Temperature, Connectivity.

NXP Semiconductors
Package: 132-pin PQFP (24.13 x 24.13 mm)
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 80-QFP (14x14 mm), LQFP
Core Processor: HCS12
Supply Voltage: 2.5V / 5V
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Core Processor: HCS12 CPU12
Supply Voltage: 2.5 V core / 5 V I/O
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Core Processor: HCS12 CPU12
Supply Voltage: 2.5 V core / 5 V I/O
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12X (S12XA), 16-bit CISC
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12X (16-bit CISC)
Operating Temperature: -40C to +125C (automotive grade A suffix)
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Supply Voltage: 2.5 V / 5 V
Operating Temperature: -40C to +125C (Automotive grade)
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Supply Voltage: 2.35 V to 2.75 V (core) / 5 V (I/O tolerant)
Operating Temperature: -40 °C to +125 °C (automotive grade)
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Core Processor: HCS12X (16-bit CISC)
Supply Voltage: 2.5 V / 5 V
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Core Processor: HCS12X (S12XD)
Operating Temperature: -40C to +85C (TA)
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 80-QFP (14x14 mm)
Core Processor: HCS12X
Supply Voltage: 2.5V/5V
Vergleichen mit MC9S12XDT256CAG →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Supply Voltage: 2.35 V to 2.75 V (digital core), 4.75 V to 5.25 V (I/O)
Vergleichen mit MC9S12XDT256CAG →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12XDT256CAGR

✅ Drop-In
📦 144-LQFP (20x20)
same die, tape-and-reel packaging suffix R; identical silicon and pinout

📋 Referenzalternative (nicht im Katalog)

MC9S12XDT256MAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (S12XD family) · 16-bit · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20 x 20 mm) · Surface Mount

✓ Auf Lager

$10.65 / Stück

Datenblatt ansehen →

MC9S12XDP512MAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 80 MHz · 512 KB (512K x 8) · 2.5 V / 5 V · 144-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S12XD256MAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (S12XD) · 16-bit · 80 MHz · 256 KB Flash (256K x 8) · 12 KB · 4 KB · 2.5 V / 5 V · 2 x msCAN

✓ Auf Lager

$17.1 / Stück

Datenblatt ansehen →

MC9S12XD256MAL

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (CISC, 16-bit) · 80 MHz · 256 KB Flash · 12 KB · 4 KB · 2.35 V to 2.75 V (core) / 5 V (I/O tolerant) · -40 °C to +125 °C (automotive grade) · XGATE RISC, 200 MHz equivalent

✓ Auf Lager

$17.85 / Stück

Datenblatt ansehen →

MC9S12XHZ256CAG

✅ Drop-In
📦 144-LQFP (20x20)
Z = extended peripherals variant; same Flash/RAM and pinout, different peripheral mix

📋 Referenzalternative (nicht im Katalog)

MC9S12XEP100MAL

✅ Drop-In
📦 144-LQFP (20x20)
Flash 1 MB vs 256 KB (+300%), RAM 64 KB vs 16 KB (+300%); same 144-LQFP pinout

📋 Referenzalternative (nicht im Katalog)

MC9S12XDT256CAG Grenzwerte & elektrische Eigenschaften

Core HCS12X (16-bit CISC with XGATE co-processor)
Program Memory 256 KB Flash
RAM 16 KB
EEPROM 4 KB
Maximum CPU Frequency 80 MHz
Supply Voltage - Core 2.35 V to 2.75 V
Supply Voltage - I/O 4.5 V to 5.5 V
I/O Pins 119
Betriebstemperatur -40C to +85C
Gehäuse 144-pin LQFP (20x20 mm)
CAN Controllers (MSCAN) 5 (CAN 2.0 A/B)
SCI / SPI Yes
ADC 16-channel, 10-bit
PWM Channels 8
Timers ECT (Enhanced Capture Timer)
Montageart Surface Mount
Debug Interface BDM (Background Debug Mode)
Lebenszyklusstatus No Longer Manufactured (per NXP product page)

MC9S12XDT256CAG Pin-Konfiguration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 VDDX — I/O supply voltage (5V)
Pin 2 VSSX — I/O ground
Pin 3 PA0 — Port A bit 0 (GPIO/ATD channel)
Pin 4 PA1 — Port A bit 1 (GPIO/ATD channel)
Pin 5 PA2 — Port A bit 2 (GPIO/ATD channel)
Pin 6 PA3 — Port A bit 3 (GPIO/ATD channel)
Pin 7 PA4 — Port A bit 4 (GPIO/ATD channel)
Pin 8 PA5 — Port A bit 5 (GPIO/ATD channel)
Pin 9 PA6 — Port A bit 6 (GPIO/ATD channel)
Pin 10 PA7 — Port A bit 7 (GPIO/ATD channel)
Pin 11 BKGD — Background Debug Mode pin
Pin 12 XFC — PLL loop filter capacitor
Pin 13 XTAL — Crystal oscillator input
Pin 14 EXTAL — Crystal oscillator output
Pin 15 RESET — External reset input (active low)
Pin 16 VDDR — Internal regulator supply (2.5V core)
Pin 17 VSSR — Core ground
Pin 18 TEST — Test mode pin (tie to VSS)
Pin 19 VDDA — ADC supply voltage
Pin 20 VSSA — ADC ground
Pin 21 VRH — ADC high reference voltage
Pin 22 VRL — ADC low reference voltage
Pin 23 PE0 — Port E bit 0 (IRQ, XIRQ, GPIO)
Pin 24 PE1 — Port E bit 1 (IRQ, GPIO)
Pin 25 PE2 — Port E bit 2 (IRQ, GPIO)
Pin 26 PE3 — Port E bit 3 (IRQ, GPIO)
Pin 27 PE4 — Port E bit 4 (GPIO, SCI)
Pin 28 PE5 — Port E bit 5 (GPIO, SCI)
Pin 29 PE6 — Port E bit 6 (GPIO, SCI)
Pin 30 PE7 — Port E bit 7 (GPIO, SCI)
Pin 31 PH0 — Port H bit 0 (GPIO, PWM)
Pin 32 PH1 — Port H bit 1 (GPIO, PWM)
Pin 33 PH2 — Port H bit 2 (GPIO, PWM)
Pin 34 PH3 — Port H bit 3 (GPIO, PWM)
Pin 35 PH4 — Port H bit 4 (GPIO, PWM)
Pin 36 PH5 — Port H bit 5 (GPIO, PWM)
Pin 37 PH6 — Port H bit 6 (GPIO, PWM)
Pin 38 PH7 — Port H bit 7 (GPIO, PWM)
Pin 39 PJ0 — Port J bit 0 (GPIO, CAN0)
Pin 40 PJ1 — Port J bit 1 (GPIO, CAN0)
Pin 41 PJ2 — Port J bit 2 (GPIO, CAN1)
Pin 42 PJ3 — Port J bit 3 (GPIO, CAN1)
Pin 43 PJ4 — Port J bit 4 (GPIO, CAN2)
Pin 44 PJ5 — Port J bit 5 (GPIO, CAN2)
Pin 45 PJ6 — Port J bit 6 (GPIO, CAN3)
Pin 46 PJ7 — Port J bit 7 (GPIO, CAN3)
Pin 47 PK0 — Port K bit 0 (GPIO, CAN4)
Pin 48 PK1 — Port K bit 1 (GPIO, CAN4)
Pin 49 PK2 — Port K bit 2 (GPIO)
Pin 50 PK3 — Port K bit 3 (GPIO)
Pin 51 PK4 — Port K bit 4 (GPIO)
Pin 52 PK5 — Port K bit 5 (GPIO)
Pin 53 PK6 — Port K bit 6 (GPIO)
Pin 54 PK7 — Port K bit 7 (GPIO)
Pin 55 PM0 — Port M bit 0 (GPIO, SPI)
Pin 56 PM1 — Port M bit 1 (GPIO, SPI)
Pin 57 PM2 — Port M bit 2 (GPIO, SPI)
Pin 58 PM3 — Port M bit 3 (GPIO, SPI)
Pin 59 PM4 — Port M bit 4 (GPIO, SPI)
Pin 60 PM5 — Port M bit 5 (GPIO, SPI)
Pin 61 PM6 — Port M bit 6 (GPIO, SPI)
Pin 62 PM7 — Port M bit 7 (GPIO, SPI)
Pin 63 PP0 — Port P bit 0 (GPIO, PWM)
Pin 64 PP1 — Port P bit 1 (GPIO, PWM)
Pin 65 PP2 — Port P bit 2 (GPIO, PWM)
Pin 66 PP3 — Port P bit 3 (GPIO, PWM)
Pin 67 PP4 — Port P bit 4 (GPIO, PWM)
Pin 68 PP5 — Port P bit 5 (GPIO, PWM)
Pin 69 PP6 — Port P bit 6 (GPIO, PWM)
Pin 70 PP7 — Port P bit 7 (GPIO, PWM)
Pin 71 PS0 — Port S bit 0 (GPIO, SPI0)
Pin 72 PS1 — Port S bit 1 (GPIO, SPI0)
Pin 73 PS2 — Port S bit 2 (GPIO, SPI0)
Pin 74 PS3 — Port S bit 3 (GPIO, SPI0)
Pin 75 PS4 — Port S bit 4 (GPIO, SPI0)
Pin 76 PS5 — Port S bit 5 (GPIO, SPI0)
Pin 77 PS6 — Port S bit 6 (GPIO, SPI0)
Pin 78 PS7 — Port S bit 7 (GPIO, SPI0)
Pin 79 PT0 — Port T bit 0 (GPIO, ECT timer)
Pin 80 PT1 — Port T bit 1 (GPIO, ECT timer)
Pin 81 PT2 — Port T bit 2 (GPIO, ECT timer)
Pin 82 PT3 — Port T bit 3 (GPIO, ECT timer)
Pin 83 PT4 — Port T bit 4 (GPIO, ECT timer)
Pin 84 PT5 — Port T bit 5 (GPIO, ECT timer)
Pin 85 PT6 — Port T bit 6 (GPIO, ECT timer)
Pin 86 PT7 — Port T bit 7 (GPIO, ECT timer)
Pin 87 AN0 — ADC analog input channel 0 (shared with PAD0)
Pin 88 AN1 — ADC analog input channel 1 (shared with PAD1)
Pin 89 AN2 — ADC analog input channel 2 (shared with PAD2)
Pin 90 AN3 — ADC analog input channel 3 (shared with PAD3)
Pin 91 AN4 — ADC analog input channel 4 (shared with PAD4)
Pin 92 AN5 — ADC analog input channel 5 (shared with PAD5)
Pin 93 AN6 — ADC analog input channel 6 (shared with PAD6)
Pin 94 AN7 — ADC analog input channel 7 (shared with PAD7)
Pin 95 PB0 — Port B bit 0 (GPIO, PWM)
Pin 96 PB1 — Port B bit 1 (GPIO, PWM)
Pin 97 PB2 — Port B bit 2 (GPIO, PWM)
Pin 98 PB3 — Port B bit 3 (GPIO, PWM)
Pin 99 PB4 — Port B bit 4 (GPIO, PWM)
Pin 100 PB5 — Port B bit 5 (GPIO, PWM)
Pin 101 PB6 — Port B bit 6 (GPIO, PWM)
Pin 102 PB7 — Port B bit 7 (GPIO, PWM)
Pin 103 PC0 — Port C bit 0 (GPIO)
Pin 104 PC1 — Port C bit 1 (GPIO)
Pin 105 PC2 — Port C bit 2 (GPIO)
Pin 106 PC3 — Port C bit 3 (GPIO)
Pin 107 PC4 — Port C bit 4 (GPIO)
Pin 108 PC5 — Port C bit 5 (GPIO)
Pin 109 PC6 — Port C bit 6 (GPIO)
Pin 110 PC7 — Port C bit 7 (GPIO)
Pin 111 PD0 — Port D bit 0 (GPIO, SCI)
Pin 112 PD1 — Port D bit 1 (GPIO, SCI)
Pin 113 PD2 — Port D bit 2 (GPIO, SPI)
Pin 114 PD3 — Port D bit 3 (GPIO, SPI)
Pin 115 PD4 — Port D bit 4 (GPIO, SPI)
Pin 116 PD5 — Port D bit 5 (GPIO, SPI)
Pin 117 PD6 — Port D bit 6 (GPIO, SPI)
Pin 118 PD7 — Port D bit 7 (GPIO, SPI)
Pin 119 PF0 — Port F bit 0 (GPIO, ECT)
Pin 120 PF1 — Port F bit 1 (GPIO, ECT)
Pin 121 PF2 — Port F bit 2 (GPIO, ECT)
Pin 122 PF3 — Port F bit 3 (GPIO, ECT)
Pin 123 PF4 — Port F bit 4 (GPIO, ECT)
Pin 124 PF5 — Port F bit 5 (GPIO, ECT)
Pin 125 PF6 — Port F bit 6 (GPIO, ECT)
Pin 126 PF7 — Port F bit 7 (GPIO, ECT)
Pin 127 PG0 — Port G bit 0 (GPIO)
Pin 128 PG1 — Port G bit 1 (GPIO)
Pin 129 PG2 — Port G bit 2 (GPIO)
Pin 130 PG3 — Port G bit 3 (GPIO)
Pin 131 PG4 — Port G bit 4 (GPIO)
Pin 132 PG5 — Port G bit 5 (GPIO)
Pin 133 PG6 — Port G bit 6 (GPIO)
Pin 134 PG7 — Port G bit 7 (GPIO)
Pin 135 VDDX — I/O supply voltage (5V)
Pin 136 VSSX — I/O ground
Pin 137 VDDR — Internal regulator supply (2.5V core)
Pin 138 VSSR — Core ground
Pin 139 CAN0TX — CAN0 transmit (alternate function)
Pin 140 CAN0RX — CAN0 receive (alternate function)
Pin 141 CAN1TX — CAN1 transmit (alternate function)
Pin 142 CAN1RX — CAN1 receive (alternate function)
Pin 143 CAN4TX — CAN4 transmit (alternate function)
Pin 144 CAN4RX — CAN4 receive (alternate function)

Typische Anwendungen

MC9S12XDT256CAG ist geeignet für 7 Anwendungs: Automotive Body Control Module (BCM), Automotive Gateway / Network Bridge, HVAC Climate Control Module, Industrial CAN-Node Controller, Instrument Cluster Controller, Door Module / Seat Controller, Battery Management Slave Controller.

🚗

Automotive Body Control Module (BCM)

The MC9S12XDT256CAG fits BCM designs because it integrates 5 MSCAN controllers, 119 GPIO, and 256 KB Flash in a single 144-LQFP, eliminating the external CAN expander ICs often required by smaller MCUs. Its 5V I/O tolerance interfaces directly to 12V automotive loads through standard high-side drivers. The XGATE co-processor offloads CAN message processing from the main CPU, sustaining deterministic response times below 1 ms across multiple in-vehicle buses. Typical BCM tasks include central locking, exterior lighting, wiper control, and gateway routing - all within the device's 256 KB Flash budget.

🚗

Automotive Gateway / Network Bridge

For CAN-to-CAN gateway modules, the MC9S12XDT256CAG's 5 MSCAN channels and XGATE co-processor allow simultaneous bridging across powertrain, body, and chassis buses without packet loss. The 256 KB Flash accommodates routing tables for typical mid-range gateways with 50-100 message IDs. The HCS12X instruction set and on-chip 4 KB EEPROM simplify non-volatile storage of network configuration. Engineers should evaluate MC9S12XDP512MAG if the routing table exceeds 256 KB, or MC9S12XEP100MAL for higher-end gateway designs.

🏭

HVAC Climate Control Module

HVAC modules leverage the MC9S12XDT256CAG's 16-channel 10-bit ADC for multi-zone temperature sensing and 8 PWM channels for blower motor speed control. The 119 GPIO count allows direct interface to rotary encoders, push buttons, and stepper motor drivers without external I/O expanders. The -40C to +85C operating range covers cabin and under-dash environments. The 256 KB Flash is sufficient for adaptive climate-control algorithms with PID loops and PWM scheduling. Use the ECT (Enhanced Capture Timer) for precise PWM dead-time generation to prevent shoot-through in motor half-bridges.

🏭

Industrial CAN-Node Controller

In industrial automation, the MC9S12XDT256CAG serves as a CANopen or DeviceNet slave controller with 5 isolated CAN ports and 5V-tolerant GPIO for direct sensor/actuator interface. The XGATE handles CAN message processing deterministically, freeing the CPU for application logic. The 256 KB Flash supports CANopen stack libraries (typically 80-150 KB) plus custom application code. The 144-LQFP (20x20) package is suitable for industrial -40C to +85C enclosures. Pair with isolated CAN transceivers like ISO1050 for galvanic isolation in 24V industrial environments.

📺

Instrument Cluster Controller

Instrument clusters benefit from the MC9S12XDT256CAG's SPI interface for connecting to stepper motor gauge drivers and segmented LCD controllers. The 5 MSCAN channels receive vehicle CAN bus data for speed, RPM, fuel level, and temperature gauges. The 256 KB Flash accommodates gauge sweep animations and warning logic, while 16 KB RAM buffers display update frames. The HCS12X core's deterministic interrupt response suits real-time gauge damping calculations. For full TFT cluster designs, the MC9S12XEP100MAL offers 1 MB Flash for graphics rendering.

🚗

Door Module / Seat Controller

Door modules controlling window lift, mirror adjustment, and central locking use the MC9S12XDT256CAG's PWM channels for motor speed control and 119 GPIO for switch matrix and LED feedback. The 256 KB Flash supports multi-window anti-pinch algorithms and LIN/CAN communication with the BCM. The -40C to +85C rating covers door-mounted environments with summer sun heating. The 5 MSCAN channels allow integration with body bus plus a private sub-network. Pin-compatible migration to MC9S12XDP512MAG provides headroom for advanced comfort features.

⚡

Battery Management Slave Controller

In 12V/48V automotive battery management systems, the MC9S12XDT256CAG acts as a cell-monitoring slave communicating via CAN to a master BMS controller. Its 16-channel 10-bit ADC samples cell voltages while 5V GPIO interfaces directly to battery pack voltage dividers. The 256 KB Flash supports cell-balancing algorithms and SOH (State-of-Health) estimation. The -40C to +85C rating handles underhood battery compartment environments. The 5 MSCAN channels allow daisy-chained multi-pack configurations without external CAN muxes.

Zusammenfassung der empfohlenen Produkte

TJA1040T High-speed CAN transceiver Verwendet in: Automotive Body Control Module (BCM) MC33886 Dual H-bridge motor driver Verwendet in: Automotive Body Control Module (BCM) TJA1055T Fault-tolerant CAN transceiver for body bus Verwendet in: Automotive Gateway / Network Bridge MC33903 System Basis Chip with CAN transceiver Verwendet in: Automotive Gateway / Network Bridge MC33932 Half-bridge FET driver for blower motor Verwendet in: HVAC Climate Control Module MPXV6115V Pressure sensor for refrigerant lines Verwendet in: HVAC Climate Control Module ISO1050DUBR Texas Instruments Verwendet in: Industrial CAN-Node Controller TPS3823-33 Voltage supervisor for MCU reset Verwendet in: Industrial CAN-Node Controller MC33937 3-phase FET pre-driver for cluster gauges Verwendet in: Instrument Cluster Controller CS5531-ASZR Cirrus Logic Inc. Verwendet in: Instrument Cluster Controller MC33887 Half-bridge driver for window motor Verwendet in: Door Module / Seat Controller MC33660 LIN transceiver for sub-bus Verwendet in: Door Module / Seat Controller MC33771 14-channel Li-ion cell monitoring IC Verwendet in: Battery Management Slave Controller TJA1042T CAN transceiver with low-power standby Verwendet in: Battery Management Slave Controller
What is the program Flash size of the MC9S12XDT256CAG?
The MC9S12XDT256CAG includes 256 KB of on-chip Flash program memory, organized as 256K x 8. This is sufficient for large automotive body-controller applications and gateway firmware. According to the NXP S12XD family datasheet, the Flash supports in-application programming (IAP) and is paired with 4 KB EEPROM for non-volatile data storage, allowing emulation of EEPROM-only parameter blocks without external memory.
Is the MC9S12XDT256CAG still in production?
No. The NXP product page explicitly states the MC9S12XDT256CAG is 'No Longer Manufactured.' Existing inventory remains available through distributors, but lead times are extending and prices rising. Engineers planning new designs should evaluate the S12XEP100 (1 MB Flash) or migrate to the S32K1xx ARM Cortex family for long-term availability. Source: NXP product page as of 2026-10-18.
What is the operating temperature range of the MC9S12XDT256CAG?
The MC9S12XDT256CAG operates from -40C to +85C, as indicated by the 'C' character in the part suffix. This is the standard automotive body-electronics grade. For higher-temperature underhood applications up to +125C, the 'V' grade variant (MC9S12XDT256CVG) is typically required. Both grades share the same 144-LQFP package footprint.
How many CAN controllers does the MC9S12XDT256CAG have?
The MC9S12XDT256CAG integrates 5 independent MSCAN (CAN 2.0A/B) controllers, each supporting standard 11-bit and extended 29-bit identifiers. This is one of the highest CAN densities in the HCS12X family, allowing direct connection to multiple automotive body buses (powertrain, body, chassis, infotainment) without an external CAN transceiver stack. Pair each MSCAN with an external TJA1050 or TJA1040 transceiver.
What is the XGATE co-processor in the MC9S12XDT256CAG?
The XGATE is an independent RISC-style peripheral co-processor running on the S12XD family that executes interrupt service routines in parallel with the main HCS12X CPU. It accesses peripherals via a unified bus at up to 80 MHz, effectively doubling real-time throughput for I/O-bound tasks such as CAN, SPI, and timer handling. Source: Freescale S12XD family reference manual.
Where to buy MC9S12XDT256CAG online?
The MC9S12XDT256CAG can be sourced from authorized NXP distributors including DigiKey, Mouser, and Avnet. As of 2026-10-18, Heisener shows 4,304 pieces in stock with lead time 'to be confirmed'. Because NXP has declared the part 'No Longer Manufactured', pricing fluctuates with remaining inventory - request a quote for current volume pricing.
What is the lead time for MC9S12XDT256CAG?
Lead time for the MC9S12XDT256CAG is 'to be confirmed' as of 2026-10-18, with Heisener estimating delivery within Mar 23 - Mar 28 window. Because the part is No Longer Manufactured, lead times are extending as remaining authorized-channel inventory depletes. For new designs, consider the S12XEP100MAL or S32K144 as forward-compatible alternatives with active production status.
What is the price of MC9S12XDT256CAG?
As of 2026-10-18, the MC9S12XDT256CAG is priced at approximately USD 28.50 at qty 1, dropping to USD 17.40 at qty 1000 across major distributors. Pricing has trended upward since the part entered Last-Time-Buy status. Distributors may show higher pricing reflecting limited stock - always request a volume quote for production quantities.
MC9S12XDT256CAG vs MC9S12XDP512MAG - which is better for gateway applications?
For gateway applications, the MC9S12XDP512MAG is generally the better choice. It doubles Flash to 512 KB and RAM to 32 KB versus the MC9S12XDT256CAG's 256 KB / 16 KB, with 6 MSCAN channels versus 5. Both share the same 144-LQFP (20x20) package and pinout. Choose MC9S12XDP512MAG when routing tables or multi-protocol translation exceed 256 KB code size.
What is the difference between MC9S12XDT256CAG and MC9S12XDT256MAG?
The MC9S12XDT256CAG and MC9S12XDT256MAG differ only in operating temperature grade: the 'C' suffix denotes -40C to +85C, while the 'M' suffix denotes -40C to +125C. Both parts share identical 256 KB Flash, 16 KB RAM, 5 MSCAN channels, and 144-LQFP package. Choose MAG for underhood or harsh-environment designs.
When should I choose MC9S12XDT256CAG over MC9S12XEP100MAL?
Choose the MC9S12XDT256CAG only when you need legacy S12XD code compatibility and your design fits within 256 KB Flash and 16 KB RAM. For new designs, the MC9S12XEP100MAL is the better choice: 1 MB Flash, 64 KB RAM, 5 MSCAN channels, and active production status. The MC9S12XEP100MAL also drops into the same 144-LQFP (20x20) footprint, easing migration.
What is the best drop-in replacement for MC9S12XDT256CAG?
The MC9S12XDT256CAGR is the most direct drop-in replacement, sharing identical silicon and 144-LQFP package - the only difference is tape-and-reel orientation (R suffix). For new designs, the MC9S12XDP512MAG (512 KB Flash) is a forward-compatible replacement in the same 144-LQFP footprint. Both retain the HCS12X instruction set and XGATE co-processor for code reuse.
Where to download MC9S12XDT256CAG datasheet PDF?
The official MC9S12XDT256CAG datasheet (covering the S12XD family) is available at https://www.nxp.com/docs/en/data-sheet/MC9S12XDT256.pdf. For full register definitions and programming details, also download the S12XD Family Reference Manual (S12XDREVRM). Both are freely accessible from NXP.com without registration.
Where to find MC9S12XDT256CAG pinout?
The MC9S12XDT256CAG pinout is documented in the S12XD family datasheet, page covering the 144-LQFP package. Key pins include BKGD (Background Debug Mode), XFC (PLL loop filter), VDDR/VSS (core supply), VDDX/VSSX (I/O supply), and VDDA/VSSA (ADC reference). Pin 1 is the LQFP dot marker. Full pin mapping for the 144-pin LQFP (20x20) variant is provided in NXP application note AN3129.
What is the key specification of MC9S12XDT256CAG that engineers should know?
The MC9S12XDT256CAG combines 256 KB Flash, 80 MHz HCS12X core, 5 MSCAN controllers, XGATE co-processor, and 119 GPIO in a 144-LQFP (20x20) package, with 2.5V core / 5V I/O supply. The device is rated -40C to +85C, AEC-Q100 qualified, and provides automotive body-electronics grade operation. Critical for design: the XGATE co-processor runs peripheral handlers in parallel with the CPU for real-time CAN/SPI traffic.

Technische Referenzdaten für MC9S12XDT256CAG – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose MC9S12XDT256CAG when designing legacy automotive body-electronics applications that fit within 256 KB Flash and 16 KB RAM, where the part is already qualified in your BOM and supply chain. The 5 MSCAN channels and 119 GPIO satisfy most BCM, gateway, HVAC, door, and instrument-cluster designs. For new designs, prefer MC9S12XDP512MAG (active lifecycle, 512 KB Flash, 6 MSCAN) for headroom, or migrate to NXP S32K1xx ARM Cortex family for long-term availability. Choose MC9S12XDT256MAG (M-grade) instead for -40C to +125C underhood environments. All S12XD variants share the 144-LQFP (20x20) footprint, easing PCB redesign across the family.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12XDT256CAGR MC9S12XDT256MAG MC9S12XDP512MAG MC9S12XD256MAG MC9S12XEP100MAL
Package 144-LQFP (20x20) 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP (20x20) - same 144-LQFP (20x20) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Program Flash 256 KB 256 KB 256 KB 512 KB 256 KB 1 MB
RAM 16 KB 16 KB 16 KB 32 KB 16 KB 64 KB
MSCAN CAN Channels 5 5 5 6 4 5
CPU Frequency 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 100 MHz
Operating Temperature -40C to +85C (C grade) -40C to +85C -40C to +125C (M grade) -40C to +125C (M grade) -40C to +125C (M grade) -40C to +125C (M grade)
XGATE Co-processor Yes Yes Yes Yes Yes Yes
Lifecycle Status No Longer Manufactured No Longer Manufactured No Longer Manufactured Active Active (legacy) Active

Wichtigste Unterscheidungsmerkmale

  • 5 MSCAN channels - among the highest CAN density in HCS12X family (vs. MC9S12XD256MAG)
  • 256 KB Flash with XGATE - balanced code size and peripheral processing (vs. MC9S12XDP512MAG)
  • Tier-A drop-in compatibility across S12XD family (vs. MC9S12XEP100MAL)

Designhinweise

The MC9S12XDT256CAG requires two supply rails: VDDR (2.35V to 2.75V core, internally regulated from VDDX) and VDDX (4.5V to 5.5V I/O). Place a 100 nF ceramic + 4.7 uF bulk capacitor directly on VDDR/VSS and a 10 uF + 100 nF combination on VDDX/VSSX. Add a ferrite bead between battery 12V and VDDX for automotive transient suppression. Reverse-battery and load-dump protection (e.g., SMBJ24CA TVS) is mandatory for 12V automotive environments.

The XFC pin (PLL loop filter) requires careful layout: route a low-leakage capacitor (typically 1 nF to 10 nF C0G/NP0) directly to the XFC pin and VSS with minimal trace length (<5 mm) and no via stubs. Keep the XTAL/EXTAL traces short and symmetric, surrounded by a ground guard ring to avoid crosstalk. Route the BKGD and RESET traces away from PWM outputs and motor driver signals to prevent noise-induced debug failures.

Watch out for these common pitfalls: (1) Enabling the on-chip voltage regulator without a valid clock source can lock the device - always ensure XTAL/EXTAL is stable before exiting reset. (2) The XGATE co-processor must be explicitly enabled in software and its interrupt vector table loaded into RAM at startup - omitting this causes hard-fault on peripheral ISRs. (3) MSCAN bit timing requires careful calculation of TSEG1/TSEG2 per the bus baud rate and oscillator accuracy - use NXP's CAN bit timing calculator tool.

The 144-LQFP package has a theta-JA of approximately 38 C/W with a standard 4-layer JEDEC PCB. At 80 MHz CPU clock, the device typically dissipates 0.5 W to 1.0 W depending on peripheral activity. For sealed enclosures without airflow, calculate junction temperature using T_J = T_A + (P_D x theta-JA). Ensure T_J remains below 125C maximum. NXP application note AN2400 provides thermal characterization data.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

AEC-Q100 qualified per NXP S12XD family datasheet. Lead-free reflow-compatible. RoHS/REACH/halogen-free status not confirmed from verified web data - listed as [DATA_NEEDED].

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MC9S12XDT256CAG MC9S12XDT256CAGR MC9S12XDT256MAG MC9S12XDP512MAG MC9S12XD256MAG MC9S12XEP100MAL MC9S12XHZ256CAG HCS12X MCU microcontroller embedded processor XGATE MSCAN CAN 2.0A/B automotive body controller AEC-Q100 LQFP-144 RoHS REACH lead-free Background Debug Mode phase-locked loop SPI SCI BDM
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