MC9S12XET256CAG vs MC9S12XA256CAG Vergleich
Detaillierter Direktvergleich von MC9S12XET256CAG von NXP Semiconductors und MC9S12XA256CAG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S12XET256CAG | MC9S12XA256CAG |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,55 | $15,95 |
| Core | S12X (16-bit CISC) + XGATE co-processor | HCS12X (S12XA family) |
| CPU Architecture | 16-bit HCS12X | — |
| Maximale Taktfrequenz | 50 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 16 KB | — |
| EEPROM (emulated) | 4 KB | — |
| ADC | 16-channel, 12-bit | — |
| CAN Modules | 4 x CAN 2.0 A/B | — |
| GPIO | Up to 119 | — |
| Gehäuse | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| Versorgungsspannung | 3.13 V to 5.5 V (single 5 V supply with on-chip regulator) | [DATA_NEEDED: supply voltage range] |
| Betriebstemperatur | -40 C to +85 C (CAG grade, see datasheet) | -40C to +85C |
| Montageart | Surface Mount | Surface Mount (LQFP, gull-wing) |
| MSL-Level | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Memory Protection Unit | Yes (supervisor/user modes) | — |
| Core Size | — | 16-bit |
| Maximum CPU Clock | — | 80 MHz |
| Program Memory Size | — | 256 KB (256K x 8) |
| Program Memory Type | — | FLASH |
| Number of I/O Pins | — | 119 |
| Connectivity | — | EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM / Data Flash | — | [DATA_NEEDED: EEPROM size] |