MC9S12XET256CAG vs MC9S12XA256CAG Comparación
Comparación detallada lado a lado de MC9S12XET256CAG por NXP Semiconductors y MC9S12XA256CAG por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S12XET256CAG | MC9S12XA256CAG |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,55 | $15,95 |
| Core | S12X (16-bit CISC) + XGATE co-processor | HCS12X (S12XA family) |
| CPU Architecture | 16-bit HCS12X | — |
| Frecuencia de reloj máxima | 50 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 16 KB | — |
| EEPROM (emulated) | 4 KB | — |
| ADC | 16-channel, 12-bit | — |
| CAN Modules | 4 x CAN 2.0 A/B | — |
| GPIO | Up to 119 | — |
| Encapsulado | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| Tensión de alimentación | 3.13 V to 5.5 V (single 5 V supply with on-chip regulator) | [DATA_NEEDED: supply voltage range] |
| Temperatura de funcionamiento | -40 C to +85 C (CAG grade, see datasheet) | -40C to +85C |
| Tipo de montaje | Surface Mount | Surface Mount (LQFP, gull-wing) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL level] |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Memory Protection Unit | Yes (supervisor/user modes) | — |
| Core Size | — | 16-bit |
| Maximum CPU Clock | — | 80 MHz |
| Program Memory Size | — | 256 KB (256K x 8) |
| Program Memory Type | — | FLASH |
| Number of I/O Pins | — | 119 |
| Connectivity | — | EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM / Data Flash | — | [DATA_NEEDED: EEPROM size] |