MCF5235CVM100 vs MCF5232CVM100 Vergleich

Detaillierter Direktvergleich von MCF5235CVM100 von NXP Semiconductors und MCF5232CVM100 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5235CVM100 MCF5235CVM100 - ColdFire V2 32-Bit 100MHz MPU | NXP

MCF5235CVM100 - ColdFire V2 32-Bit 100MHz MPU | NXP

MCF5235CVM100 Nrnd
NXP Semiconductors
MCF5232CVM100 MCF5232CVM100 - ColdFire V2 MPU, 100MHz, 196-LBGA | NXP

MCF5232CVM100 - ColdFire V2 MPU, 100MHz, 196-LBGA | NXP

MCF5232CVM100 Nrnd

Spezifikationsvergleich

Parameter MCF5235CVM100 MCF5232CVM100
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $25,40 $19,20
Core Architecture ColdFire V2 (32-bit) ColdFire V2 (32-bit RISC)
Maximum Core Frequency 100 MHz —
On-chip SRAM 64 kB 64 KB
On-chip ROM ROMless ROMless
Operating Voltage Range [DATA_NEEDED: core and I/O voltage levels] —
Package Type 256-MAPBGA (17x17 mm) —
Ethernet MAC 10/100 Mbps Fast Ethernet MAC 10/100 Mbps (FEC)
Enhanced Time Processing Unit (eTPU) 16 channels —
Hardware Encryption Accelerator Yes (SEC block) —
External Memory Interface SDRAM / SRAM / ROM controller (32-bit) —
DMA Channels [DATA_NEEDED: number of DMA channels] —
UART / SCI Channels [DATA_NEEDED: number of UART channels] —
QSPI / SPI Yes —
I2C Controller Yes —
Betriebstemperaturbereich [DATA_NEEDED: industrial temp grade] —
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant Compliant
Core Frequency — 100 MHz
Performance — 125 Dhrystone 2.1 MIPS
On-chip Cache — 8 KB I-cache / 8 KB D-cache (configurable)
Enhanced Timer (eTPU) — 16 channels
Encryption Accelerator — Hardware-accelerated (integrated)
DMA — 4-channel + external request/acknowledge
External Bus Interface — 32-bit (SRAM/ROM/Flash/DDR)
Gehäuse — 196-LBGA (MAP-BGA) 15x15 mm
Betriebstemperatur — -40C to +85C (industrial)
Versorgungsspannung — 1.5V core / 3.3V I/O (typical)
Lebenszyklusstatus — NRND (Not Recommended for New Designs)

Datenblätter & Ressourcen

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