MCF5235CVM100 vs MCF5232CVM100 Comparación
Comparación detallada lado a lado de MCF5235CVM100 por NXP Semiconductors y MCF5232CVM100 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF5235CVM100 | MCF5232CVM100 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,40 | $19,20 |
| Core Architecture | ColdFire V2 (32-bit) | ColdFire V2 (32-bit RISC) |
| Maximum Core Frequency | 100 MHz | — |
| On-chip SRAM | 64 kB | 64 KB |
| On-chip ROM | ROMless | ROMless |
| Operating Voltage Range | [DATA_NEEDED: core and I/O voltage levels] | — |
| Package Type | 256-MAPBGA (17x17 mm) | — |
| Ethernet MAC | 10/100 Mbps Fast Ethernet MAC | 10/100 Mbps (FEC) |
| Enhanced Time Processing Unit (eTPU) | 16 channels | — |
| Hardware Encryption Accelerator | Yes (SEC block) | — |
| External Memory Interface | SDRAM / SRAM / ROM controller (32-bit) | — |
| DMA Channels | [DATA_NEEDED: number of DMA channels] | — |
| UART / SCI Channels | [DATA_NEEDED: number of UART channels] | — |
| QSPI / SPI | Yes | — |
| I2C Controller | Yes | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: industrial temp grade] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | Compliant |
| Core Frequency | — | 100 MHz |
| Performance | — | 125 Dhrystone 2.1 MIPS |
| On-chip Cache | — | 8 KB I-cache / 8 KB D-cache (configurable) |
| Enhanced Timer (eTPU) | — | 16 channels |
| Encryption Accelerator | — | Hardware-accelerated (integrated) |
| DMA | — | 4-channel + external request/acknowledge |
| External Bus Interface | — | 32-bit (SRAM/ROM/Flash/DDR) |
| Encapsulado | — | 196-LBGA (MAP-BGA) 15x15 mm |
| Temperatura de funcionamiento | — | -40C to +85C (industrial) |
| Tensión de alimentación | — | 1.5V core / 3.3V I/O (typical) |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |