MCF5235CVM150 vs MCF5234CVM150J Vergleich

Detaillierter Direktvergleich von MCF5235CVM150 von NXP Semiconductors und MCF5234CVM150J von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5235CVM150 MCF5235CVM150 - 150MHz ColdFire V2 MPU | NXP

MCF5235CVM150 - 150MHz ColdFire V2 MPU | NXP

MCF5235CVM150 Nrnd
NXP Semiconductors
MCF5234CVM150J MCF5234CVM150J - 150MHz ColdFire V2 MCU 256-MAPBGA | NXP

MCF5234CVM150J - 150MHz ColdFire V2 MCU 256-MAPBGA | NXP

MCF5234CVM150J Obsolete

Spezifikationsvergleich

Parameter MCF5235CVM150 MCF5234CVM150J
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $17,10
Product Type 32-bit ColdFire V2 integrated microprocessor —
Processor Core ColdFire V2 —
Maximale Taktfrequenz 150 MHz 150 MHz
Architecture Width 32 bit —
Internal SRAM 64 KB —
Program Memory Type ROM-less ROMless
Enhanced Time Processing Unit 16-channel eTPU —
Ethernet MAC 10/100 Ethernet MAC 10/100 Mbps Fast Ethernet (MII/RMII)
Security Feature Hardware-accelerated encryption —
Communications Peripherals Integrated communications peripherals —
Gehäuse 256-map BGA, 17 mm x 17 mm —
Package Family BGA surface-mount package —
Montageart Surface mount Surface Mount
Product Category Microcontroller / integrated microprocessor —
Manufacturer Lifecycle Status NRND —
Operating Voltage Range [DATA_NEEDED: Operating Voltage Range] —
Betriebstemperaturbereich [DATA_NEEDED: Operating Temperature Range] —
External Memory Interfaces [DATA_NEEDED: External Memory Interfaces] —
RoHS-Status [DATA_NEEDED: RoHS Status] [DATA_NEEDED: verify per NXP product page]
REACH Status [DATA_NEEDED: REACH Status] —
Core — ColdFire V2
Datenbusbreite — 32 bit
On-chip SRAM — 64 KB
External Memory Support — ROMless (SRAM/Flash/SDRAM external)
Maximum I/O Count — 97
Gehäuse / Bauform — 256-MAPBGA (17x17 mm)
CAN Controllers — 2x CAN 2.0B
UART — 3x
I2C — 2x
QSPI — 1x
DMA Channels — 16-channel
Hardware Encryption — ColdFire eMAC (AES/DES/3DES)
Versorgungsspannung — 1.5 V core / 3.3 V I/O
Betriebstemperatur — -40C to +85C (industrial) [DATA_NEEDED: exact temp grade]
MSL-Level — 3 [DATA_NEEDED: official JEDEC MSL rating]

Datenblätter & Ressourcen

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