MCF5235CVM150 vs MCF5234CVM150J Comparación
Comparación detallada lado a lado de MCF5235CVM150 por NXP Semiconductors y MCF5234CVM150J por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF5235CVM150 | MCF5234CVM150J |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $17,10 |
| Product Type | 32-bit ColdFire V2 integrated microprocessor | — |
| Processor Core | ColdFire V2 | — |
| Frecuencia de reloj máxima | 150 MHz | 150 MHz |
| Architecture Width | 32 bit | — |
| Internal SRAM | 64 KB | — |
| Program Memory Type | ROM-less | ROMless |
| Enhanced Time Processing Unit | 16-channel eTPU | — |
| Ethernet MAC | 10/100 Ethernet MAC | 10/100 Mbps Fast Ethernet (MII/RMII) |
| Security Feature | Hardware-accelerated encryption | — |
| Communications Peripherals | Integrated communications peripherals | — |
| Encapsulado | 256-map BGA, 17 mm x 17 mm | — |
| Package Family | BGA surface-mount package | — |
| Tipo de montaje | Surface mount | Surface Mount |
| Product Category | Microcontroller / integrated microprocessor | — |
| Manufacturer Lifecycle Status | NRND | — |
| Operating Voltage Range | [DATA_NEEDED: Operating Voltage Range] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature Range] | — |
| External Memory Interfaces | [DATA_NEEDED: External Memory Interfaces] | — |
| Estado RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: verify per NXP product page] |
| REACH Status | [DATA_NEEDED: REACH Status] | — |
| Core | — | ColdFire V2 |
| Ancho del bus de datos | — | 32 bit |
| On-chip SRAM | — | 64 KB |
| External Memory Support | — | ROMless (SRAM/Flash/SDRAM external) |
| Maximum I/O Count | — | 97 |
| Encapsulado / Carcasa | — | 256-MAPBGA (17x17 mm) |
| CAN Controllers | — | 2x CAN 2.0B |
| UART | — | 3x |
| I2C | — | 2x |
| QSPI | — | 1x |
| DMA Channels | — | 16-channel |
| Hardware Encryption | — | ColdFire eMAC (AES/DES/3DES) |
| Tensión de alimentación | — | 1.5 V core / 3.3 V I/O |
| Temperatura de funcionamiento | — | -40C to +85C (industrial) [DATA_NEEDED: exact temp grade] |
| Nivel MSL | — | 3 [DATA_NEEDED: official JEDEC MSL rating] |