MCF5235CVM150 vs MCF5234CVM150J Comparaison
Comparaison détaillée côte à côte de MCF5235CVM150 par NXP Semiconductors et MCF5234CVM150J par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MCF5235CVM150 | MCF5234CVM150J |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $17,10 |
| Product Type | 32-bit ColdFire V2 integrated microprocessor | — |
| Processor Core | ColdFire V2 | — |
| Fréquence d'horloge maximale | 150 MHz | 150 MHz |
| Architecture Width | 32 bit | — |
| Internal SRAM | 64 KB | — |
| Program Memory Type | ROM-less | ROMless |
| Enhanced Time Processing Unit | 16-channel eTPU | — |
| Ethernet MAC | 10/100 Ethernet MAC | 10/100 Mbps Fast Ethernet (MII/RMII) |
| Security Feature | Hardware-accelerated encryption | — |
| Communications Peripherals | Integrated communications peripherals | — |
| Boîtier | 256-map BGA, 17 mm x 17 mm | — |
| Package Family | BGA surface-mount package | — |
| Type de montage | Surface mount | Surface Mount |
| Product Category | Microcontroller / integrated microprocessor | — |
| Manufacturer Lifecycle Status | NRND | — |
| Operating Voltage Range | [DATA_NEEDED: Operating Voltage Range] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: Operating Temperature Range] | — |
| External Memory Interfaces | [DATA_NEEDED: External Memory Interfaces] | — |
| Statut RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: verify per NXP product page] |
| REACH Status | [DATA_NEEDED: REACH Status] | — |
| Core | — | ColdFire V2 |
| Largeur du bus de données | — | 32 bit |
| On-chip SRAM | — | 64 KB |
| External Memory Support | — | ROMless (SRAM/Flash/SDRAM external) |
| Maximum I/O Count | — | 97 |
| Boîtier / Format | — | 256-MAPBGA (17x17 mm) |
| CAN Controllers | — | 2x CAN 2.0B |
| UART | — | 3x |
| I2C | — | 2x |
| QSPI | — | 1x |
| DMA Channels | — | 16-channel |
| Hardware Encryption | — | ColdFire eMAC (AES/DES/3DES) |
| Tension d'alimentation | — | 1.5 V core / 3.3 V I/O |
| Température de fonctionnement | — | -40C to +85C (industrial) [DATA_NEEDED: exact temp grade] |
| Niveau MSL | — | 3 [DATA_NEEDED: official JEDEC MSL rating] |