MCF5275LCVM166 vs MCF5275CVM166 Vergleich
Detaillierter Direktvergleich von MCF5275LCVM166 von NXP Semiconductors und MCF5275CVM166 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
MCF5275CVM166 NrndSpezifikationsvergleich
| Parameter | MCF5275LCVM166 | MCF5275CVM166 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,55 | $24,20 |
| Core Architecture | ColdFire V2 (32-bit, variable-length RISC) | — |
| Maximum Core Clock | 166 MHz | — |
| On-chip SRAM | 64 KB | — |
| Program Memory | ROMless (external memory required) | — |
| Versorgungsspannung | 3.3 V I/O, internal core rail generated on-chip | — |
| Ethernet | 10/100 MAC with MII/RMII | Dual 10/100 MAC |
| USB | USB 2.0 full-speed device/host | USB 1.1 device/host |
| UART | 2 | — |
| I2C | 2 | — |
| DMA Channels | 16 (eDMA) | — |
| Timers | 4 x 32-bit | — |
| External Bus | 16-bit EBI (SDRAM/SRAM/ROM) | — |
| Gehäuse | 196-LBGA (15x15 mm) | 256-MAPBGA (17x17 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| RoHS-Status | Compliant | Compliant |
| Core | — | ColdFire V2 (32-bit) |
| Maximale Taktfrequenz | — | 166 MHz |
| On-Chip SRAM | — | 64 KB |
| Program Memory Size | — | ROMless |
| Program Memory Type | — | External (ROMless) |
| Number of I/O Lines | — | 69 |
| Connectivity | — | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB |
| CAN | — | 2x CAN 2.0B |
| Peripherals | — | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) |
| Supply Voltage Core | — | 1.5 V |
| Supply Voltage I/O | — | 3.3 V |