MCF5307FT66B vs MCF5307AI66B Vergleich

Detaillierter Direktvergleich von MCF5307FT66B von NXP Semiconductors und MCF5307AI66B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5307FT66B MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B Nrnd
NXP Semiconductors
MCF5307AI66B MCF5307AI66B - ColdFire V3 32-bit 66MHz MCU | NXP

MCF5307AI66B - ColdFire V3 32-bit 66MHz MCU | NXP

MCF5307AI66B ✗ Abgekündigt

Spezifikationsvergleich

Parameter MCF5307FT66B MCF5307AI66B
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $16,80 $36,49
Core Architecture ColdFire V3 (MCF530x) —
Datenbusbreite 32-bit —
Maximale Taktfrequenz 66 MHz —
Program Memory Type ROMless (external memory required) ROMless
On-chip SRAM 4 KB (4K x 8) —
Number of I/O Lines 16 —
Oscillator Type External —
Gehäuse / Bauform 208-BFQFP (28x28 mm) —
Montageart Surface Mount Surface Mount
Versorgungsspannung [DATA_NEEDED: VDD nominal - 3.3 V typical per family datasheet] [DATA_NEEDED: supply voltage range]
Betriebstemperatur [DATA_NEEDED: temperature grade per device marking] [DATA_NEEDED: operating temperature range]
External Memory Controller Yes (ROM/SRAM/DRAM/Flash) —
DMA Channels [DATA_NEEDED: DMA channel count] —
Timers [DATA_NEEDED: timer module count] —
Serial Interfaces [DATA_NEEDED: UART/SPI/I2C instance count] —
RoHS-Status [DATA_NEEDED: per device marking] [DATA_NEEDED: RoHS status]
Packaging (distributor) Tray —
Core Processor — ColdFire V3 (MCF530x)
Core Size — 32-Bit
Maximum Clock Speed — 66 MHz
Performance — 70 MIPS
RAM Size — 4 KB SRAM
Connectivity — EBI/EMI, I2C, UART/USART
Peripherals — DMA, POR, WDT
Number of I/O — 16
DRAM Controller — Yes (integrated)
MAC Module — Yes (multiply-accumulate)
Gehäuse — 208-FQFP (28x28 mm)
Part Status — End of Life / Not For New Designs

Datenblätter & Ressourcen

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