MPC565CVR56 vs MPCZ565MVR56 Vergleich
Detaillierter Direktvergleich von MPC565CVR56 von NXP Semiconductors und MPCZ565MVR56 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoleteSpezifikationsvergleich
| Parameter | MPC565CVR56 | MPCZ565MVR56 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Unknown | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $52,75 |
| Architecture | Power Architecture, 32-bit | — |
| Processor Core | Single core | — |
| Product Family | MPC5xx / MPC500 family | — |
| Manufacturer Frequency Listing | 40 MHz | — |
| Distributor Frequency Listing | 56 MHz | — |
| Flash Memory | 1 MB, listed as 1M x 8 by distributor sources | — |
| Program Memory Type | Embedded Flash | — |
| Floating-Point Unit | Integrated floating-point unit | — |
| Peripheral Set | Advanced peripheral set | — |
| Automotive Grade | Automotive Grade | Yes |
| Betriebstemperatur | -40 °C to +85 °C | — |
| Gehäuse | 388-PBGA | — |
| Package Ball Count | 388 balls | — |
| Package Dimensions | 27 mm x 27 mm | — |
| Montageart | Surface mount, ball-grid array | Surface Mount |
| Supplier Inventory Listing | 5,664 pieces on Heisener listing | — |
| Unit Price Listing | $139.2941 per unit on Heisener listing | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Datenbusbreite | — | 32-bit |
| Program Memory Size | — | 1 MB Flash |
| RAM Size | — | 64 KB [DATA_NEEDED: exact value] |
| Maximale Taktfrequenz | — | 40 MHz |
| Supply Voltage Range | — | [DATA_NEEDED: Vdd/Vdd range] |
| Betriebstemperaturbereich | — | -40C to +125C |
| Gehäuse / Bauform | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Process Technology | — | 0.25 micron CMOS |