MPC565CVR56 vs MPCZ565MVR56 对比
详细并排对比 MPC565CVR56 出自 NXP Semiconductors 和 MPCZ565MVR56 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 Obsolete规格对比
| 参数 | MPC565CVR56 | MPCZ565MVR56 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Unknown | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $52.75 |
| Architecture | Power Architecture, 32-bit | — |
| Processor Core | Single core | — |
| Product Family | MPC5xx / MPC500 family | — |
| Manufacturer Frequency Listing | 40 MHz | — |
| Distributor Frequency Listing | 56 MHz | — |
| Flash Memory | 1 MB, listed as 1M x 8 by distributor sources | — |
| Program Memory Type | Embedded Flash | — |
| Floating-Point Unit | Integrated floating-point unit | — |
| Peripheral Set | Advanced peripheral set | — |
| Automotive Grade | Automotive Grade | Yes |
| 工作温度 | -40 °C to +85 °C | — |
| 封装 | 388-PBGA | — |
| Package Ball Count | 388 balls | — |
| Package Dimensions | 27 mm x 27 mm | — |
| 安装类型 | Surface mount, ball-grid array | Surface Mount |
| Supplier Inventory Listing | 5,664 pieces on Heisener listing | — |
| Unit Price Listing | $139.2941 per unit on Heisener listing | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| 数据总线宽度 | — | 32-bit |
| Program Memory Size | — | 1 MB Flash |
| RAM Size | — | 64 KB [DATA_NEEDED: exact value] |
| 最大时钟频率 | — | 40 MHz |
| Supply Voltage Range | — | [DATA_NEEDED: Vdd/Vdd range] |
| 工作温度范围 | — | -40C to +125C |
| 封装 / 外壳 | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| 湿敏等级（MSL） | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Process Technology | — | 0.25 micron CMOS |