MPC565CVR56 vs MPCZ565MVR56 比較

詳細な並列比較: MPC565CVR56 メーカー: NXP Semiconductors および MPCZ565MVR56 メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

NXP Semiconductors
MPC565CVR56 MPC565CVR56 - 32-Bit 56 MHz Automotive MCU | NXP

MPC565CVR56 - 32-Bit 56 MHz Automotive MCU | NXP

MPC565CVR56 Unknown
NXP Semiconductors
MPCZ565MVR56 MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP

MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP

MPCZ565MVR56 Obsolete

仕様比較

パラメータ MPC565CVR56 MPCZ565MVR56
ブランド NXP Semiconductors NXP Semiconductors
カテゴリ Microcontrollers Microcontrollers
ライフサイクル状態 Unknown Obsolete
在庫状況 In Stock In Stock
単価(USD) $0.00 $52.75
Architecture Power Architecture, 32-bit —
Processor Core Single core —
Product Family MPC5xx / MPC500 family —
Manufacturer Frequency Listing 40 MHz —
Distributor Frequency Listing 56 MHz —
Flash Memory 1 MB, listed as 1M x 8 by distributor sources —
Program Memory Type Embedded Flash —
Floating-Point Unit Integrated floating-point unit —
Peripheral Set Advanced peripheral set —
Automotive Grade Automotive Grade Yes
動作温度 -40 °C to +85 °C —
パッケージ 388-PBGA —
Package Ball Count 388 balls —
Package Dimensions 27 mm x 27 mm —
実装タイプ Surface mount, ball-grid array Surface Mount
Supplier Inventory Listing 5,664 pieces on Heisener listing —
Unit Price Listing $139.2941 per unit on Heisener listing —
RoHS ステータス [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Core Architecture — Power Architecture (MPC500 family)
データバス幅 — 32-bit
Program Memory Size — 1 MB Flash
RAM Size — 64 KB [DATA_NEEDED: exact value]
最大クロック周波数 — 40 MHz
Supply Voltage Range — [DATA_NEEDED: Vdd/Vdd range]
動作温度範囲 — -40C to +125C
パッケージ / ケース — 388-ball PBGA
Number of I/O Pins — [DATA_NEEDED: exact I/O count]
Floating Point Unit — Yes (IEEE 754)
CAN Controllers — 2 (CAN 2.0B)
ADC Channels — 40 (QADC)
Timers — 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count]
Debug Interface — JTAG / OnCE / BDM
湿気感度レベル(MSL) — 3
Peak Reflow Temperature — 260C (40s max)
Terminal Finish — Tin Silver Copper (e1 per JESD-609)
Process Technology — 0.25 micron CMOS

データシート&リソース

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