MPC565CVR56 vs MPCZ565MVR56 Comparación
Comparación detallada lado a lado de MPC565CVR56 por NXP Semiconductors y MPCZ565MVR56 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoleteComparación de especificaciones
| Parámetro | MPC565CVR56 | MPCZ565MVR56 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Unknown | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $52,75 |
| Architecture | Power Architecture, 32-bit | — |
| Processor Core | Single core | — |
| Product Family | MPC5xx / MPC500 family | — |
| Manufacturer Frequency Listing | 40 MHz | — |
| Distributor Frequency Listing | 56 MHz | — |
| Flash Memory | 1 MB, listed as 1M x 8 by distributor sources | — |
| Program Memory Type | Embedded Flash | — |
| Floating-Point Unit | Integrated floating-point unit | — |
| Peripheral Set | Advanced peripheral set | — |
| Automotive Grade | Automotive Grade | Yes |
| Temperatura de funcionamiento | -40 °C to +85 °C | — |
| Encapsulado | 388-PBGA | — |
| Package Ball Count | 388 balls | — |
| Package Dimensions | 27 mm x 27 mm | — |
| Tipo de montaje | Surface mount, ball-grid array | Surface Mount |
| Supplier Inventory Listing | 5,664 pieces on Heisener listing | — |
| Unit Price Listing | $139.2941 per unit on Heisener listing | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Ancho del bus de datos | — | 32-bit |
| Program Memory Size | — | 1 MB Flash |
| RAM Size | — | 64 KB [DATA_NEEDED: exact value] |
| Frecuencia de reloj máxima | — | 40 MHz |
| Supply Voltage Range | — | [DATA_NEEDED: Vdd/Vdd range] |
| Rango de temperatura de funcionamiento | — | -40C to +125C |
| Encapsulado / Carcasa | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Process Technology | — | 0.25 micron CMOS |