MPC745BVT300LE vs MPC755CPX400LE Vergleich

Detaillierter Direktvergleich von MPC745BVT300LE von NXP Semiconductors und MPC755CPX400LE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC745BVT300LE MPC745BVT300LE - PowerPC MPU 300MHz 32-Bit 255-FCPBGA | NXP

MPC745BVT300LE - PowerPC MPU 300MHz 32-Bit 255-FCPBGA | NXP

MPC745BVT300LE Nrnd
NXP Semiconductors
MPC755CPX400LE MPC755CPX400LE - 400MHz PowerPC G3 MPU | NXP | 360-FCBGA

MPC755CPX400LE - 400MHz PowerPC G3 MPU | NXP | 360-FCBGA

MPC755CPX400LE Obsolete

Spezifikationsvergleich

Parameter MPC745BVT300LE MPC755CPX400LE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Obsolete
Family MPC7xx (PowerPC G4) —
Core Architecture PowerPC Book E, 32-bit PowerPC 32-bit RISC, 64-bit external bus
Core Clock Speed 300 MHz 400 MHz
Process Technology 0.18 micrometer CMOS 0.22 um CMOS, 5 metal layers
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache Interface External (cache-as-RAM supported) —
External Data Bus Width 64-bit —
Address Bus Width 32-bit 32-bit
Core Supply Voltage (Vdd) 1.55 V to 1.65 V (1.6 V nominal) —
I/O Supply Voltage (Vdd_IO) 3.135 V to 3.465 V (3.3 V nominal) —
Operating Temperature (TA) 0C to 105C —
Gehäuse 255-FCPBGA (21x21 mm) 360-FCBGA (25 mm x 25 mm)
Montageart Surface Mount (BGA) Surface Mount (Flip-Chip BGA)
MSL-Level [DATA_NEEDED: MSL rating] —
JTAG / Debug Port IEEE 1149.1 JTAG + COP —
Endianness Big-endian and Little-endian (selectable) —
RoHS-Status [DATA_NEEDED: per datasheet] —
Manufacturer — NXP Semiconductors (formerly Motorola/Freescale)
Part Family — MPC7xx PowerPC G3
Datenbusbreite — 64-bit
On-chip L2 Cache — 256 KB unified with ECC
Floating Point Unit — Double-precision IEEE-754 FPU
Supply Voltage - Core — 2.5 V
Supply Voltage - I/O — 3.3 V
Betriebs-Sperrschichttemperatur — 0 C to +105 C
Weight / Tray Qty — [DATA_NEEDED: tray quantity]
Lead Free / RoHS — SnPb solder balls - NOT RoHS compliant
Pin-Anzahl — 360
Addressable Memory — Up to 2 GB via 32-bit address bus
Lebenszyklusstatus — Obsolete - last time-buy programs are closed

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern