MPC745BVT300LE vs MPC755CPX400LE 对比
详细并排对比 MPC745BVT300LE 出自 NXP Semiconductors 和 MPC755CPX400LE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC745BVT300LE | MPC755CPX400LE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| Family | MPC7xx (PowerPC G4) | — |
| Core Architecture | PowerPC Book E, 32-bit | PowerPC 32-bit RISC, 64-bit external bus |
| Core Clock Speed | 300 MHz | 400 MHz |
| Process Technology | 0.18 micrometer CMOS | 0.22 um CMOS, 5 metal layers |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache Interface | External (cache-as-RAM supported) | — |
| External Data Bus Width | 64-bit | — |
| Address Bus Width | 32-bit | 32-bit |
| Core Supply Voltage (Vdd) | 1.55 V to 1.65 V (1.6 V nominal) | — |
| I/O Supply Voltage (Vdd_IO) | 3.135 V to 3.465 V (3.3 V nominal) | — |
| Operating Temperature (TA) | 0C to 105C | — |
| 封装 | 255-FCPBGA (21x21 mm) | 360-FCBGA (25 mm x 25 mm) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| JTAG / Debug Port | IEEE 1149.1 JTAG + COP | — |
| Endianness | Big-endian and Little-endian (selectable) | — |
| RoHS 状态 | [DATA_NEEDED: per datasheet] | — |
| Manufacturer | — | NXP Semiconductors (formerly Motorola/Freescale) |
| Part Family | — | MPC7xx PowerPC G3 |
| 数据总线宽度 | — | 64-bit |
| On-chip L2 Cache | — | 256 KB unified with ECC |
| Floating Point Unit | — | Double-precision IEEE-754 FPU |
| Supply Voltage - Core | — | 2.5 V |
| Supply Voltage - I/O | — | 3.3 V |
| 工作结温 | — | 0 C to +105 C |
| Weight / Tray Qty | — | [DATA_NEEDED: tray quantity] |
| Lead Free / RoHS | — | SnPb solder balls - NOT RoHS compliant |
| 引脚数量 | — | 360 |
| Addressable Memory | — | Up to 2 GB via 32-bit address bus |
| 生命周期状态 | — | Obsolete - last time-buy programs are closed |