MPC745BVT300LE vs MPC755CPX400LE Comparaison
Comparaison détaillée côte à côte de MPC745BVT300LE par NXP Semiconductors et MPC755CPX400LE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPC745BVT300LE | MPC755CPX400LE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Obsolete |
| Family | MPC7xx (PowerPC G4) | — |
| Core Architecture | PowerPC Book E, 32-bit | PowerPC 32-bit RISC, 64-bit external bus |
| Core Clock Speed | 300 MHz | 400 MHz |
| Process Technology | 0.18 micrometer CMOS | 0.22 um CMOS, 5 metal layers |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache Interface | External (cache-as-RAM supported) | — |
| External Data Bus Width | 64-bit | — |
| Address Bus Width | 32-bit | 32-bit |
| Core Supply Voltage (Vdd) | 1.55 V to 1.65 V (1.6 V nominal) | — |
| I/O Supply Voltage (Vdd_IO) | 3.135 V to 3.465 V (3.3 V nominal) | — |
| Operating Temperature (TA) | 0C to 105C | — |
| Boîtier | 255-FCPBGA (21x21 mm) | 360-FCBGA (25 mm x 25 mm) |
| Type de montage | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| JTAG / Debug Port | IEEE 1149.1 JTAG + COP | — |
| Endianness | Big-endian and Little-endian (selectable) | — |
| Statut RoHS | [DATA_NEEDED: per datasheet] | — |
| Manufacturer | — | NXP Semiconductors (formerly Motorola/Freescale) |
| Part Family | — | MPC7xx PowerPC G3 |
| Largeur du bus de données | — | 64-bit |
| On-chip L2 Cache | — | 256 KB unified with ECC |
| Floating Point Unit | — | Double-precision IEEE-754 FPU |
| Supply Voltage - Core | — | 2.5 V |
| Supply Voltage - I/O | — | 3.3 V |
| Température de jonction en fonctionnement | — | 0 C to +105 C |
| Weight / Tray Qty | — | [DATA_NEEDED: tray quantity] |
| Lead Free / RoHS | — | SnPb solder balls - NOT RoHS compliant |
| Nombre de broches | — | 360 |
| Addressable Memory | — | Up to 2 GB via 32-bit address bus |
| Statut du cycle de vie | — | Obsolete - last time-buy programs are closed |